Loon Aik Lim

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Patents Grantslast 30 patents

Information Patent Grant
Capillary for wire bonding
- Patent number 7,427,009
- Issue date Sep 23, 2008
- ASM Technology Singapore Pte. Ltd.
- Loon A Lim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mold and method for encapsulation of electronic device
- Patent number 6,770,163
- Issue date Aug 3, 2004
- ASM Technology Singapore Pte. Ltd.
- Teng Hock Kuah
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
WIRE BONDING PROCESS FOR INSULATED WIRES
- Publication number 20070262119
- Publication date Nov 15, 2007
- Malliah Ramkumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPILLARY FOR A BONDING TOOL
- Publication number 20070125831
- Publication date Jun 7, 2007
- Srikanth NARASIMALU
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Capillary for wire bonding
- Publication number 20050284913
- Publication date Dec 29, 2005
- ASM Technology Singapore Pte Ltd
- Loon Aik Lim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR