Loon Kwang Tan

Person

Kepala Batas, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Ceramic carrier and build up carrier for light-emitting diode (LED)...
- Patent number 12,191,280
- Issue date Jan 7, 2025
- Lumileds, LLC
- Loon-Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic carrier and build up carrier for light-emitting diode (LED)...
- Patent number 11,664,347
- Issue date May 30, 2023
- Lumileds LLC
- Loon-Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging integrated circuits
- Patent number 9,748,197
- Issue date Aug 29, 2017
- Altera Corporation
- Loon Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with solderless interconnection structure
- Patent number 9,425,174
- Issue date Aug 23, 2016
- Altera Corporation
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for packaging integrated circuits
- Patent number 9,401,287
- Issue date Jul 26, 2016
- Altera Corporation
- Loon Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with a universal lead frame
- Patent number 9,337,240
- Issue date May 10, 2016
- Altera Corporation
- Guan Khai Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermoset molding for on-package decoupling in flip chips
- Patent number 8,541,263
- Issue date Sep 24, 2013
- Altera Corporation
- Teik Tiong Toong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with capacitors disposed on an interposal layer
- Patent number 8,525,326
- Issue date Sep 3, 2013
- Altera Corporation
- Teik Tiong Toong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC package with capacitors disposed on an interposal layer
- Patent number 7,989,942
- Issue date Aug 2, 2011
- Altera Corporation
- Teik Tiong Toong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CERAMIC CARRIER AND BUILD UP CARRIER FOR LIGHT-EMITTING DIODE (LED)...
- Publication number 20230253365
- Publication date Aug 10, 2023
- Lumileds LLC
- Loon-Kwang TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC CARRIER AND BUILD UP CARRIER FOR LIGHT-EMITTING DIODE (LED)...
- Publication number 20210210463
- Publication date Jul 8, 2021
- Lumileds LLC
- Loon-Kwang TAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20160307868
- Publication date Oct 20, 2016
- Altera Corporation
- Loon Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PACKAGING INTEGRATED CIRCUITS
- Publication number 20150228506
- Publication date Aug 13, 2015
- Altera Corporation
- Loon Kwang Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH CAPACITORS DISPOSED ON AN INTERPOSAL LAYER
- Publication number 20110272785
- Publication date Nov 10, 2011
- Teik Tiong Toong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC PACKAGE WITH CAPACITORS DISPOSED ON AN INTERPOSAL LAYER
- Publication number 20100181644
- Publication date Jul 22, 2010
- Teik Tiong Toong
- H01 - BASIC ELECTRIC ELEMENTS

Loon Kwang Tan

Person

Patents Grantslast 30 patents

Ceramic carrier and build up carrier for light-emitting diode (LED)...

Ceramic carrier and build up carrier for light-emitting diode (LED)...

Methods for packaging integrated circuits

Integrated circuit package with solderless interconnection structure

Methods for packaging integrated circuits

Integrated circuit package with a universal lead frame

Thermoset molding for on-package decoupling in flip chips

IC package with capacitors disposed on an interposal layer

IC package with capacitors disposed on an interposal layer

Patents Applicationslast 30 patents

CERAMIC CARRIER AND BUILD UP CARRIER FOR LIGHT-EMITTING DIODE (LED)...

CERAMIC CARRIER AND BUILD UP CARRIER FOR LIGHT-EMITTING DIODE (LED)...

METHODS FOR PACKAGING INTEGRATED CIRCUITS

METHODS FOR PACKAGING INTEGRATED CIRCUITS

IC PACKAGE WITH CAPACITORS DISPOSED ON AN INTERPOSAL LAYER

IC PACKAGE WITH CAPACITORS DISPOSED ON AN INTERPOSAL LAYER