Lori A. Dunaway

Person

New Hope, MN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip packaging systems and methods
- Patent number 7,314,777
- Issue date Jan 1, 2008
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for particle reduction in MEMS devices
- Patent number 7,297,573
- Issue date Nov 20, 2007
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for attaching getters to MEMS device housings
- Patent number 7,074,636
- Issue date Jul 11, 2006
- Honeywell International Inc.
- Harlan L. Curtis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for attaching a die to a substrate
- Patent number 7,037,805
- Issue date May 2, 2006
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for particle reduction in MEMS devices
- Patent number 6,987,304
- Issue date Jan 17, 2006
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for attaching MEMS devices to housing
- Patent number 6,927,098
- Issue date Aug 9, 2005
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods and apparatus for attaching getters to MEMS device housings
- Patent number 6,914,323
- Issue date Jul 5, 2005
- Honeywell International Inc.
- Harlan L. Curtis
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS BUMP PATTERN DIE ALIGNMENT SYSTEMS AND METHODS
- Publication number 20100020517
- Publication date Jan 28, 2010
- Honeywell International Inc.
- Bryan Seppala
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Chip Packaging Systems and Methods
- Publication number 20080063505
- Publication date Mar 13, 2008
- Honeywell International Inc.
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Chip packaging systems and methods
- Publication number 20060105499
- Publication date May 18, 2006
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for particle reduction in MEMS devices
- Publication number 20060076633
- Publication date Apr 13, 2006
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for attaching getters to MEMS device housings
- Publication number 20050208739
- Publication date Sep 22, 2005
- Harlan L. Curtis
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for attaching a die to a substrate
- Publication number 20040232455
- Publication date Nov 25, 2004
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for attaching MEMS devices to housing
- Publication number 20040223373
- Publication date Nov 11, 2004
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for particle reduction in MEMS devices
- Publication number 20040222468
- Publication date Nov 11, 2004
- Jon B. DCamp
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Methods and apparatus for attaching getters to MEMS device housings
- Publication number 20040183177
- Publication date Sep 23, 2004
- Harlan L. Curtis
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Lori A. Dunaway

Person

Patents Grantslast 30 patents

Chip packaging systems and methods

Methods and apparatus for particle reduction in MEMS devices

Methods and apparatus for attaching getters to MEMS device housings

Methods and apparatus for attaching a die to a substrate

Methods and apparatus for particle reduction in MEMS devices

Methods and apparatus for attaching MEMS devices to housing

Methods and apparatus for attaching getters to MEMS device housings

Patents Applicationslast 30 patents

MEMS BUMP PATTERN DIE ALIGNMENT SYSTEMS AND METHODS

Chip Packaging Systems and Methods

Chip packaging systems and methods

Methods and apparatus for particle reduction in MEMS devices

Methods and apparatus for attaching getters to MEMS device housings

Methods and apparatus for attaching a die to a substrate

Methods and apparatus for attaching MEMS devices to housing

Methods and apparatus for particle reduction in MEMS devices

Methods and apparatus for attaching getters to MEMS device housings