Lothar Koenig

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Laaber, DE

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Patents Grantslast 30 patents

Information Patent Grant
Power module with cooling structure on bonding substrate for coolin...
- Patent number 9,275,926
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Wolfram Hable
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including bond wire directly bonded to pad
- Patent number 8,432,024
- Issue date Apr 30, 2013
- Infineon Technologies AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power module with cooling structure on bonding substrate for coolin...
- Publication number 20140327127
- Publication date Nov 6, 2014
- Wolfram HABLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING BOND WIRE DIRECTLY BONDED TO PAD
- Publication number 20110260307
- Publication date Oct 27, 2011
- INFINEON TECHNOLOGIES AG
- Manfred Schneegans
- H01 - BASIC ELECTRIC ELEMENTS