Lothar Lehmann

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Radebeul, DE

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure with dielectric material to cover hori...
- Patent number 11,557,421
- Issue date Jan 17, 2023
- GLOBALFOUNDRIES Dresden Module One Limited Liability Company & Co. KG
- Frank G. Küchenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bump structures that include a protection layer
- Patent number 8,580,672
- Issue date Nov 12, 2013
- GLOBALFOUNDRIES Inc.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH DIELECTRIC MATERIAL TO COVER HORI...
- Publication number 20210280352
- Publication date Sep 9, 2021
- GLOBALFOUNDRIES Dresden Module One Limited Liability Company & Co. KG
- Frank G. Küchenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH BUMP STRUCTURES THAT INCLUDE A PROT...
- Publication number 20140021604
- Publication date Jan 23, 2014
- GLOBALFOUNDRIES INC.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Bump Structures That Include a Protection Layer
- Publication number 20130099372
- Publication date Apr 25, 2013
- GLOBALFOUNDRIES INC.
- Frank Kuechenmeister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER
- Publication number 20080099913
- Publication date May 1, 2008
- Matthias Lehr
- H01 - BASIC ELECTRIC ELEMENTS