Lothar Mergili

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Radebeul, DE

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor substrate thinning method for manufacturing thinned die
- Patent number 7,375,032
- Issue date May 20, 2008
- Advanced Micro Devices, Inc.
- Frank Seliger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming copper interconnect capping layers with improved...
- Patent number 6,596,631
- Issue date Jul 22, 2003
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming capped copper interconnects with reduced hillocks
- Patent number 6,368,948
- Issue date Apr 9, 2002
- Advanced Micro Devices, Inc.
- Minh Van Ngo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor substrate thinning method for manufacturing thinned die
- Publication number 20060068595
- Publication date Mar 30, 2006
- Frank Seliger
- H01 - BASIC ELECTRIC ELEMENTS