Louie Lin

Follow

Person

Taipei Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Socket having a structure for grasping solder balls
- Patent number 7,147,489
- Issue date Dec 12, 2006
- Tai Twun Enterprise Co., Ltd.
- Louie Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR