Louis R. HEDTKE, JR.

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St. Clair Shores, MI, US

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Patents Applicationslast 30 patents

Information Patent Application
Weight Material Dispensing, Cutting, And Applying System
- Publication number 20110283790
- Publication date Nov 24, 2011
- ESYS CORPORATION
- Louis R. HEDTKE, JR.
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
WEIGHT MATERIAL DISPENSING AND CUTTING SYSTEM
- Publication number 20100175522
- Publication date Jul 15, 2010
- ESYS CORPORATION
- Louis R. HEDTKE, JR.
- B26 - HAND CUTTING TOOLS CUTTING SEVERING