Louis Yang

Person

San Francisco, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of depositing low k barrier layers
- Patent number 7,319,068
- Issue date Jan 15, 2008
- Applied Materials, Inc.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low K barrier layers
- Patent number 7,125,813
- Issue date Oct 24, 2006
- Applied Materials, Inc.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a low k dielectric barrier film for copper dam...
- Patent number 6,849,562
- Issue date Feb 1, 2005
- Applied Materials, Inc.
- Chi-I Lang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing low k barrier layers
- Patent number 6,759,327
- Issue date Jul 6, 2004
- Applied Materials Inc.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a low k dielectric film (K>3.5) for h...
- Patent number 6,699,784
- Issue date Mar 2, 2004
- Applied Materials Inc.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DEPOSITING LOW K BARRIER LAYERS
- Publication number 20070042610
- Publication date Feb 22, 2007
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low K barrier layers
- Publication number 20040198070
- Publication date Oct 7, 2004
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Methods for depositing dielectric material
- Publication number 20030194496
- Publication date Oct 16, 2003
- APPLIED MATERIALS, INC.
- Ping Xu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a low k dielectric barrier film for copper dam...
- Publication number 20030165618
- Publication date Sep 4, 2003
- APPLIED MATERIALS, INC.
- Chi-I Lang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for depositing a low k dielectric film (k<3.5) for hard mask...
- Publication number 20030113995
- Publication date Jun 19, 2003
- APPLIED MATERIALS, INC.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low k barrier layers
- Publication number 20030068881
- Publication date Apr 10, 2003
- APPLIED MATERIALS, INC.
- Li-Qun Xia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Method of depositing low k barrier layers

Method of depositing low K barrier layers

Method of depositing a low k dielectric barrier film for copper dam...

Method of depositing low k barrier layers

Method for depositing a low k dielectric film (K&#x0003E;3.5) for h...

Patents Applicationslast 30 patents

METHOD OF DEPOSITING LOW K BARRIER LAYERS

Method of depositing low K barrier layers

Methods for depositing dielectric material

Method of depositing a low k dielectric barrier film for copper dam...

Method for depositing a low k dielectric film (k<3.5) for hard mask...

Method of depositing low k barrier layers

Method for depositing a low k dielectric film (K>3.5) for h...