Lovell B. Wiggins

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a lead-free tin-silver-copper based solder alloy...
- Patent number 6,596,621
- Issue date Jul 22, 2003
- International Business Machines Corporation
- Bruce Anthony Copeland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-adjusting semiconductor package stand-offs
- Patent number 5,950,073
- Issue date Sep 7, 1999
- International Business Machines Corporation
- Michael J. Griffin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a low dielectric composite substrate
- Patent number 5,277,725
- Issue date Jan 11, 1994
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for fabricating superconductor packages
- Patent number 5,215,610
- Issue date Jun 1, 1993
- International Business Machines Corporation
- Nunzio DiPaolo
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Low dielectric composite substrate
- Patent number 5,139,851
- Issue date Aug 18, 1992
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Process for fabricating a low dielectric composite substrate
- Patent number 5,135,595
- Issue date Aug 4, 1992
- International Business Machines Corporation
- John Acocella
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Lovell B. Wiggins

Person

Patents Grantslast 30 patents

Method of forming a lead-free tin-silver-copper based solder alloy...

Self-adjusting semiconductor package stand-offs

Process for fabricating a low dielectric composite substrate

Method for fabricating superconductor packages

Low dielectric composite substrate

Process for fabricating a low dielectric composite substrate