Low Peng Wang

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and methods for forming wire bonds
- Patent number 8,444,044
- Issue date May 21, 2013
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure for multiple die stack
- Patent number 7,906,853
- Issue date Mar 15, 2011
- Micron Technology, Inc.
- Low Peng Wang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHODS FOR FORMING WIRE BONDS
- Publication number 20090223937
- Publication date Sep 10, 2009
- Micron Technology, Inc.
- Low Peng Wang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package structure for multiple die stack
- Publication number 20090065948
- Publication date Mar 12, 2009
- Micron Technology, Inc.
- Low Peng Wang
- H01 - BASIC ELECTRIC ELEMENTS