Loyde M. Carpenter JR.

Person

Palm Bay, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatuses and methods for encapsulated devices
- Patent number 11,150,710
- Issue date Oct 19, 2021
- Intersil Americas LLC
- Randolph Cruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of fabricating a circuit module
- Patent number 10,582,617
- Issue date Mar 3, 2020
- Intersil Americas LLC
- Jian Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for encapsulated devices
- Patent number 10,317,965
- Issue date Jun 11, 2019
- Intersil Americas LLC
- Randolph Cruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit module such as a high-density lead frame array (HDA) power...
- Patent number 9,717,146
- Issue date Jul 25, 2017
- Intersil Americas LLC
- Jian Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder flow-impeding plug on a lead frame
- Patent number 9,627,297
- Issue date Apr 18, 2017
- Intersil Americas LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged circuit with a lead frame and laminate substrate
- Patent number 9,613,889
- Issue date Apr 4, 2017
- Intersil Americas LLC
- Jian Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame having a perimeter recess within periphery of component...
- Patent number 9,536,852
- Issue date Jan 3, 2017
- Intersil Americas LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder flow-impeding plug on a lead frame
- Patent number 9,177,896
- Issue date Nov 3, 2015
- Intersil Americas LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder flow impeding feature on a lead frame
- Patent number 9,018,746
- Issue date Apr 28, 2015
- Intersil Americas LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a packaged circuit including a lead frame a...
- Patent number 9,012,267
- Issue date Apr 21, 2015
- Intersil Americas LLC
- Jian Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder flow-impeding plug on a lead frame
- Patent number 8,969,137
- Issue date Mar 3, 2015
- Intersil Americas LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder flow impeding feature on a lead frame
- Patent number 8,877,564
- Issue date Nov 4, 2014
- Intersil Americas LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame having a perimeter recess within periphery of component...
- Patent number 8,871,572
- Issue date Oct 28, 2014
- Intersil Americas LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUSES AND METHODS FOR ENCAPSULATED DEVICES
- Publication number 20190294225
- Publication date Sep 26, 2019
- INTERSIL AMERICAS LLC
- Randolph Cruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT MODULE SUCH AS A HIGH-DENSITY LEAD FRAME ARRAY POWER MODULE...
- Publication number 20170325333
- Publication date Nov 9, 2017
- INTERSIL AMERICAS LLC
- Jian YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE
- Publication number 20170162488
- Publication date Jun 8, 2017
- INTERSIL AMERICAS LLC
- Jian Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatuses and Methods for Encapsulated Devices
- Publication number 20170077807
- Publication date Mar 16, 2017
- INTERSIL AMERICAS LLC
- Randolph Cruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SOLDER FLOW-IMPEDING PLUG ON A LEAD FRAME
- Publication number 20160056093
- Publication date Feb 25, 2016
- INTERSIL AMERICA LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE
- Publication number 20150194370
- Publication date Jul 9, 2015
- INTERSIL AMERICAS LLC
- Jian Yin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FLOW-IMPEDING PLUG ON A LEAD FRAME
- Publication number 20150130038
- Publication date May 14, 2015
- INTERSIL AMERICAS LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FLOW IMPEDING FEATURE ON A LEAD FRAME
- Publication number 20150014835
- Publication date Jan 15, 2015
- INTERSIL AMERICAS LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME HAVING A PERIMETER RECESS WITHIN PERIPHERY OF COMPONENT...
- Publication number 20140175627
- Publication date Jun 26, 2014
- INTERSIL AMERICAS LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FLOW-IMPEDING PLUG ON A LEAD FRAME
- Publication number 20140097529
- Publication date Apr 10, 2014
- INTERSIL AMERICAS LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER FLOW IMPEDING FEATURE ON A LEAD FRAME
- Publication number 20140001618
- Publication date Jan 2, 2014
- INTERSIL AMERICAS LLC
- Randolph Cruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT MODULE SUCH AS A HIGH-DENSITY LEAD FRAME ARRAY (HDA) POWER...
- Publication number 20130314879
- Publication date Nov 28, 2013
- INTERSIL AMERICAS LLC
- Jian YIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE
- Publication number 20130313694
- Publication date Nov 28, 2013
- INTERSIL AMERICAS LLC
- Jian Yin
- H01 - BASIC ELECTRIC ELEMENTS

Loyde M. Carpenter JR.

Person

Patents Grantslast 30 patents

Apparatuses and methods for encapsulated devices

Method of fabricating a circuit module

Apparatuses and methods for encapsulated devices

Circuit module such as a high-density lead frame array (HDA) power...

Solder flow-impeding plug on a lead frame

Packaged circuit with a lead frame and laminate substrate

Lead frame having a perimeter recess within periphery of component...

Solder flow-impeding plug on a lead frame

Solder flow impeding feature on a lead frame

Method of manufacturing a packaged circuit including a lead frame a...

Solder flow-impeding plug on a lead frame

Solder flow impeding feature on a lead frame

Lead frame having a perimeter recess within periphery of component...

Patents Applicationslast 30 patents

APPARATUSES AND METHODS FOR ENCAPSULATED DEVICES

CIRCUIT MODULE SUCH AS A HIGH-DENSITY LEAD FRAME ARRAY POWER MODULE...

PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE

Apparatuses and Methods for Encapsulated Devices

SOLDER FLOW-IMPEDING PLUG ON A LEAD FRAME

PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE

SOLDER FLOW-IMPEDING PLUG ON A LEAD FRAME

SOLDER FLOW IMPEDING FEATURE ON A LEAD FRAME

LEAD FRAME HAVING A PERIMETER RECESS WITHIN PERIPHERY OF COMPONENT...

SOLDER FLOW-IMPEDING PLUG ON A LEAD FRAME

SOLDER FLOW IMPEDING FEATURE ON A LEAD FRAME

CIRCUIT MODULE SUCH AS A HIGH-DENSITY LEAD FRAME ARRAY (HDA) POWER...

PACKAGED CIRCUIT WITH A LEAD FRAME AND LAMINATE SUBSTRATE