Lu-Chen Hwan

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Hsinchu, TW

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Patents Grantslast 30 patents

Information Patent Grant
System and method of laser sintering dies and dies sintered by lase...
- Patent number 6,602,762
- Issue date Aug 5, 2003
- Chipbond Technology Corporation
- Lu-Chen Hwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
System and method of laser sintering dies and dies sintered by lase...
- Publication number 20030203209
- Publication date Oct 30, 2003
- Chipbond Technology Corporation
- Lu-Chen Hwan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
System and method of laser sintering dies and dies sintered by lase...
- Publication number 20030008529
- Publication date Jan 9, 2003
- Chipbond Technology Corporation
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallized surface wafer level package structure
- Publication number 20020180064
- Publication date Dec 5, 2002
- Chipbond Technology Corporation
- Lu-Chen Hwan
- H01 - BASIC ELECTRIC ELEMENTS