Lu Li

Person

Gilbert, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Radio frequency packages containing multilevel power substrates and...
- Patent number 12,040,291
- Issue date Jul 16, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface structures, electrical systems with thermal inter...
- Patent number 12,014,971
- Issue date Jun 18, 2024
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency packages containing substrates with coefficient of...
- Patent number 11,929,310
- Issue date Mar 12, 2024
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with thermal vias and sinter-bonded thermal dissipation s...
- Patent number 11,621,228
- Issue date Apr 4, 2023
- NXP USA, INC.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,861,764
- Issue date Dec 8, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic component mounting using sinter attachment
- Patent number 10,806,021
- Issue date Oct 13, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic modules including thermal extension levels and meth...
- Patent number 10,440,813
- Issue date Oct 8, 2019
- NXP USA, INC.
- Lu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic component mounting using sinter attachment
- Patent number 10,405,417
- Issue date Sep 3, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,269,678
- Issue date Apr 23, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with isolation wall
- Patent number 9,607,953
- Issue date Mar 28, 2017
- NXP USA, INC.
- Lu Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor devices, semiconductor device packages, and packaging...
- Patent number 9,484,222
- Issue date Nov 1, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Hussain H. Ladhani
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF FABRICATING SUBSTRATES WITH THERMAL VIAS AND SINTER-BONDE...
- Publication number 20230230924
- Publication date Jul 20, 2023
- NXP USA, Inc.
- Lu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...
- Publication number 20230197645
- Publication date Jun 22, 2023
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY PACKAGES CONTAINING SUBSTRATES WITH COEFFICIENT OF...
- Publication number 20230187325
- Publication date Jun 15, 2023
- NXP USA, Inc.
- Lu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE-MOUNT AMPLIFIER DEVICES
- Publication number 20230133034
- Publication date May 4, 2023
- NXP USA, Inc.
- Lu LI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
THERMAL INTERFACE STRUCTURES, ELECTRICAL SYSTEMS WITH THERMAL INTER...
- Publication number 20220384307
- Publication date Dec 1, 2022
- NXP USA, Inc.
- Lu Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE WITH THERMAL VIAS AND SINTER-BONDED THERMAL DISSIPATION S...
- Publication number 20220068817
- Publication date Mar 3, 2022
- NXP USA, Inc.
- Lu LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT
- Publication number 20190342988
- Publication date Nov 7, 2019
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...
- Publication number 20190206759
- Publication date Jul 4, 2019
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT
- Publication number 20180317312
- Publication date Nov 1, 2018
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES, SEMICONDUCTOR DEVICE PACKAGES, AND PACKAGING...
- Publication number 20150235933
- Publication date Aug 20, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Hussain H. Ladhani
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Radio frequency packages containing multilevel power substrates and...

Thermal interface structures, electrical systems with thermal inter...

Radio frequency packages containing substrates with coefficient of...

Substrate with thermal vias and sinter-bonded thermal dissipation s...

Microelectronic components having integrated heat dissipation posts...

Packaged microelectronic component mounting using sinter attachment

Microelectronic modules including thermal extension levels and meth...

Packaged microelectronic component mounting using sinter attachment

Microelectronic components having integrated heat dissipation posts...

Semiconductor package with isolation wall

Semiconductor devices, semiconductor device packages, and packaging...

Patents Applicationslast 30 patents

METHOD OF FABRICATING SUBSTRATES WITH THERMAL VIAS AND SINTER-BONDE...

RADIO FREQUENCY PACKAGES CONTAINING MULTILEVEL POWER SUBSTRATES AND...

RADIO FREQUENCY PACKAGES CONTAINING SUBSTRATES WITH COEFFICIENT OF...

SURFACE-MOUNT AMPLIFIER DEVICES

THERMAL INTERFACE STRUCTURES, ELECTRICAL SYSTEMS WITH THERMAL INTER...

SUBSTRATE WITH THERMAL VIAS AND SINTER-BONDED THERMAL DISSIPATION S...

PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT

MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...

PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT

SEMICONDUCTOR DEVICES, SEMICONDUCTOR DEVICE PACKAGES, AND PACKAGING...