Lu-Yi Chen

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication method of semiconductor package with stacked semiconduc...
- Patent number 11,101,235
- Issue date Aug 24, 2021
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical testing method of interposer
- Patent number 10,950,507
- Issue date Mar 16, 2021
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 10,796,970
- Issue date Oct 6, 2020
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package with stacked semiconduc...
- Patent number 10,622,323
- Issue date Apr 14, 2020
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 10,403,570
- Issue date Sep 3, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabrication method thereof
- Patent number 10,242,972
- Issue date Mar 26, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 10,201,086
- Issue date Feb 5, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 10,141,233
- Issue date Nov 27, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,128,178
- Issue date Nov 13, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with stacked semiconductor chips
- Patent number 9,997,481
- Issue date Jun 12, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer and electrical testing method thereof
- Patent number 9,991,178
- Issue date Jun 5, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure, packaging substrate, electronic package and fabr...
- Patent number 9,818,635
- Issue date Nov 14, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and fabrication method thereof
- Patent number 9,735,075
- Issue date Aug 15, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 9,601,403
- Issue date Mar 21, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with first and second conductive bumps having d...
- Patent number 9,515,039
- Issue date Dec 6, 2016
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of wafer level semiconductor package and fabrica...
- Patent number 9,269,602
- Issue date Feb 23, 2016
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUC...
- Publication number 20200152591
- Publication date May 14, 2020
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20190057911
- Publication date Feb 21, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20190043798
- Publication date Feb 7, 2019
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUC...
- Publication number 20180261563
- Publication date Sep 13, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL TESTING METHOD OF INTERPOSER
- Publication number 20180254227
- Publication date Sep 6, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF ELECTRONIC PACKAGE
- Publication number 20180047610
- Publication date Feb 15, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20180042112
- Publication date Feb 8, 2018
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20170338173
- Publication date Nov 23, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF ELECTRONIC MODULE
- Publication number 20170309534
- Publication date Oct 26, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
- Publication number 20170148761
- Publication date May 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20170047262
- Publication date Feb 16, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE, PACKAGING SUBSTRATE, ELECTRONIC PACKAGE AND FABR...
- Publication number 20170033027
- Publication date Feb 2, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20170005023
- Publication date Jan 5, 2017
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE WITH FIRST AND SECOND CONDUCTIVE BUMPS HAVING D...
- Publication number 20160322323
- Publication date Nov 3, 2016
- Siliconware Precision Industries Co., Ltd.
- Chieh-Lung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20160233194
- Publication date Aug 11, 2016
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE AND FABRICATION METHOD THEREOF
- Publication number 20160066406
- Publication date Mar 3, 2016
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035164
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150035163
- Publication date Feb 5, 2015
- Siliconware Precision Industries Co., Ltd.
- Guang-Hwa Ma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE
- Publication number 20140167598
- Publication date Jun 19, 2014
- Genius Electronic Optical Co., Ltd.
- Feng-Kuan CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20130299961
- Publication date Nov 14, 2013
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERPOSER AND ELECTRICAL TESTING METHOD THEREOF
- Publication number 20130249589
- Publication date Sep 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF WAFER LEVEL SEMICONDUCTOR PACKAGE AND FABRICA...
- Publication number 20130252383
- Publication date Sep 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Fabrication method of semiconductor package with stacked semiconduc...

Electrical testing method of interposer

Method for fabricating electronic package

Fabrication method of semiconductor package with stacked semiconduc...

Method for fabricating electronic package

Package structure and fabrication method thereof

Electronic device

Electronic package and fabrication method thereof

Electronic package and method for fabricating the same

Semiconductor package with stacked semiconductor chips

Interposer and electrical testing method thereof

Carrier structure, packaging substrate, electronic package and fabr...

Electronic module and fabrication method thereof

Electronic package and fabrication method thereof

Substrate structure with first and second conductive bumps having d...

Fabrication method of wafer level semiconductor package and fabrica...

Patents Applicationslast 30 patents

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUC...

METHOD FOR FABRICATING ELECTRONIC PACKAGE

METHOD FOR FABRICATING ELECTRONIC PACKAGE

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE WITH STACKED SEMICONDUC...

ELECTRICAL TESTING METHOD OF INTERPOSER

FABRICATION METHOD OF ELECTRONIC PACKAGE

ELECTRONIC DEVICE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

FABRICATION METHOD OF ELECTRONIC MODULE

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

CARRIER STRUCTURE, PACKAGING SUBSTRATE, ELECTRONIC PACKAGE AND FABR...

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

SUBSTRATE STRUCTURE WITH FIRST AND SECOND CONDUCTIVE BUMPS HAVING D...

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

ELECTRONIC MODULE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

LIGHT EMITTING DEVICE

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

INTERPOSER AND ELECTRICAL TESTING METHOD THEREOF

FABRICATION METHOD OF WAFER LEVEL SEMICONDUCTOR PACKAGE AND FABRICA...