Luc Guerin

Person

Quebec, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Wind deflector for a vehicle towing a trailer
- Patent number 10,926,813
- Issue date Feb 23, 2021
- Luc Guerin
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
High-density chip-to-chip interconnection with silicon bridge
- Patent number 10,784,202
- Issue date Sep 22, 2020
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly with connected component
- Patent number 10,211,174
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly with connected component
- Patent number 9,984,988
- Issue date May 29, 2018
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ashing of polyimide for semiconductor manufacturing
- Patent number 9,865,564
- Issue date Jan 9, 2018
- GLOBALFOUNDRIES Inc.
- Maxime Cadotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
All intermetallic compound with stand off feature and method to make
- Patent number 9,793,232
- Issue date Oct 17, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Flip chip assembly with connected component
- Patent number 9,553,079
- Issue date Jan 24, 2017
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary liquid thermal interface material for surface tension adh...
- Patent number 9,269,603
- Issue date Feb 23, 2016
- GLOBALFOUNDRIES Inc.
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser ashing of polyimide for semiconductor manufacturing
- Patent number 8,999,107
- Issue date Apr 7, 2015
- International Business Machines Corporation
- Maxime Cadotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder ball contact susceptible to lower stress
- Patent number 8,614,512
- Issue date Dec 24, 2013
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carrier optoelectronic packaging
- Patent number 8,559,474
- Issue date Oct 15, 2013
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Grant
Technique for verifying the microstructure of lead-free interconnec...
- Patent number 8,514,386
- Issue date Aug 20, 2013
- International Business Machines Corporation
- Christian Bergeron
- G01 - MEASURING TESTING
Information Patent Grant
Solder ball contact susceptible to lower stress
- Patent number 8,383,505
- Issue date Feb 26, 2013
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming solder bump interconnects
- Patent number 8,328,156
- Issue date Dec 11, 2012
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carrier optoelectronic packaging
- Patent number 8,290,008
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Grant
Techniques for forming solder bump interconnects
- Patent number 8,148,255
- Issue date Apr 3, 2012
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package having non-aligned active vias
- Patent number 7,868,459
- Issue date Jan 11, 2011
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods involving marking molds
- Patent number 7,837,419
- Issue date Nov 23, 2010
- International Business Machines Corporation
- Eric Bouchard
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Enhanced via structure for organic module performance
- Patent number 7,312,523
- Issue date Dec 25, 2007
- International Business Machines Corporation
- Jean J. Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Area array package with low inductance connecting device
- Patent number 7,066,740
- Issue date Jun 27, 2006
- International Business Machines Corporation
- Jean Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connecting devices and method for interconnecting circuit components
- Patent number 6,652,290
- Issue date Nov 25, 2003
- International Business Machines Corporation
- Gerald P. Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming an electrical connector
- Patent number 6,532,654
- Issue date Mar 18, 2003
- International Business Machines Corporation
- Luc Gilbert Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compliant leads for area array surface mounted components
- Patent number 6,339,534
- Issue date Jan 15, 2002
- International Business Machines Corporation
- Patrick A. Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connecting devices and method for interconnecting circuit components
- Patent number 6,302,702
- Issue date Oct 16, 2001
- International Business Machines Corporation
- Gerald P. Audet
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wind Deflector for a Vehicle Towing a Trailer
- Publication number 20200114984
- Publication date Apr 16, 2020
- Luc Guerin
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Application
HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE
- Publication number 20190172787
- Publication date Jun 6, 2019
- International Business Machines Corporation
- Francois Arguin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT
- Publication number 20170170133
- Publication date Jun 15, 2017
- International Business Machines Corporation
- JEAN AUDET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT
- Publication number 20170170134
- Publication date Jun 15, 2017
- International Business Machines Corporation
- JEAN AUDET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20150162300
- Publication date Jun 11, 2015
- International Business Machines Corporation
- Maxime Cadotte
- B32 - LAYERED PRODUCTS
Information Patent Application
TEMPORARY LIQUID THERMAL INTERFACE MATERIAL FOR SURFACE TENSION ADH...
- Publication number 20140332810
- Publication date Nov 13, 2014
- International Business Machines Corporation
- Luc GUERIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS
- Publication number 20130015579
- Publication date Jan 17, 2013
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARRIER OPTOELECTRONIC PACKAGING
- Publication number 20120326290
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
TECHNIQUE FOR VERIFYING THE MICROSTRUCTURE OF LEAD-FREE INTERCONNEC...
- Publication number 20120300220
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Christian Bergeron
- G01 - MEASURING TESTING
Information Patent Application
SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS
- Publication number 20120256313
- Publication date Oct 11, 2012
- International Business Machines Corporation
- Luc Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Forming Solder Bump Interconnects
- Publication number 20120138769
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING
- Publication number 20120111496
- Publication date May 10, 2012
- International Business Machines Corporation
- Maxime Cadotte
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON CARRIER OPTOELECTRONIC PACKAGING
- Publication number 20110044369
- Publication date Feb 24, 2011
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
METHODS INVOLVING MARKING MOLDS
- Publication number 20090123589
- Publication date May 14, 2009
- International Business Machines Corporation
- Eric Bouchard
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Techniques For Forming Solder Bump Interconnects
- Publication number 20090072392
- Publication date Mar 19, 2009
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING NON-ALIGNED ACTIVE VIAS
- Publication number 20080054482
- Publication date Mar 6, 2008
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED VIA STRUCTURE FOR ORGANIC MODULE PERFORMANCE
- Publication number 20070023913
- Publication date Feb 1, 2007
- International Business Machines Corporation
- Jean J. Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STANDOFF STRUCTURES FOR SURFACE MOUNT COMPONENTS
- Publication number 20070007323
- Publication date Jan 11, 2007
- International Business Machines Corporation
- David J. Russell
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AREA ARRAY PACKAGE WITH LOW INDUCTANCE CONNECTING DEVICE
- Publication number 20050013124
- Publication date Jan 20, 2005
- International Business Machines Corporation
- Jean Audet
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of forming an electrical connector
- Publication number 20020092164
- Publication date Jul 18, 2002
- Luc Gilbert Guerin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Connecting devices and method for interconnecting circuit components
- Publication number 20020019153
- Publication date Feb 14, 2002
- Gerald P. Audet
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Wind deflector for a vehicle towing a trailer

High-density chip-to-chip interconnection with silicon bridge

Flip chip assembly with connected component

Flip chip assembly with connected component

Laser ashing of polyimide for semiconductor manufacturing

All intermetallic compound with stand off feature and method to make

Flip chip assembly with connected component

Temporary liquid thermal interface material for surface tension adh...

Laser ashing of polyimide for semiconductor manufacturing

Solder ball contact susceptible to lower stress

Silicon carrier optoelectronic packaging

Technique for verifying the microstructure of lead-free interconnec...

Solder ball contact susceptible to lower stress

Techniques for forming solder bump interconnects

Silicon carrier optoelectronic packaging

Techniques for forming solder bump interconnects

Semiconductor package having non-aligned active vias

Methods involving marking molds

Enhanced via structure for organic module performance

Area array package with low inductance connecting device

Connecting devices and method for interconnecting circuit components

Method of forming an electrical connector

Compliant leads for area array surface mounted components

Connecting devices and method for interconnecting circuit components

Patents Applicationslast 30 patents

Wind Deflector for a Vehicle Towing a Trailer

HIGH-DENSITY CHIP-TO-CHIP INTERCONNECTION WITH SILICON BRIDGE

FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT

FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT

LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING

TEMPORARY LIQUID THERMAL INTERFACE MATERIAL FOR SURFACE TENSION ADH...

SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS

SILICON CARRIER OPTOELECTRONIC PACKAGING

TECHNIQUE FOR VERIFYING THE MICROSTRUCTURE OF LEAD-FREE INTERCONNEC...

SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS

Techniques for Forming Solder Bump Interconnects

LASER ASHING OF POLYIMIDE FOR SEMICONDUCTOR MANUFACTURING

SILICON CARRIER OPTOELECTRONIC PACKAGING

METHODS INVOLVING MARKING MOLDS

Techniques For Forming Solder Bump Interconnects

SEMICONDUCTOR PACKAGE HAVING NON-ALIGNED ACTIVE VIAS

ENHANCED VIA STRUCTURE FOR ORGANIC MODULE PERFORMANCE

STANDOFF STRUCTURES FOR SURFACE MOUNT COMPONENTS

AREA ARRAY PACKAGE WITH LOW INDUCTANCE CONNECTING DEVICE

Method of forming an electrical connector

Connecting devices and method for interconnecting circuit components