Luc Petit

Person

Fontaine, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device comprising an encapsulating block locally of smal...
- Patent number 10,186,466
- Issue date Jan 22, 2019
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device comprising an encapsulating block locally of smal...
- Patent number 9,818,664
- Issue date Nov 14, 2017
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side package on package
- Patent number 9,006,904
- Issue date Apr 14, 2015
- STMicroelectronics (Grenoble 2) SAS
- Dominique Marais
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing electrical-connections on a semiconductor pac...
- Patent number 6,528,407
- Issue date Mar 4, 2003
- STMicroelectronics S.A.
- Luc Petit
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing electrical connections on the surface of a se...
- Patent number 6,399,475
- Issue date Jun 4, 2002
- STMicroelectronics S.A.
- Luc Petit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Casing for integrated circuit chips and method of fabrication
- Patent number 6,049,971
- Issue date Apr 18, 2000
- SGS-Thomson Microelectronics S.A.
- Luc Petit
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having mechanically and electrically bonded s...
- Patent number 5,959,355
- Issue date Sep 28, 1999
- SGS-Thomson Microelectronics S.A.
- Luc Petit
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION
- Publication number 20250079259
- Publication date Mar 6, 2025
- STMicroelectronics International N.V.
- Jerome LOPEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES
- Publication number 20230411271
- Publication date Dec 21, 2023
- STMicroelectronics (Grenoble 2) SAS
- Luc PETIT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ENCAPSULATING BLOCK LOCALLY OF SMAL...
- Publication number 20180033710
- Publication date Feb 1, 2018
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COMPRISING AN ENCAPSULATING BLOCK LOCALLY OF SMAL...
- Publication number 20170250119
- Publication date Aug 31, 2017
- STMicroelectronics (Grenoble 2) SAS
- Benoit Besancon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE PACKAGE ON PACKAGE
- Publication number 20130214425
- Publication date Aug 22, 2013
- STMicroelectronics (Grenoble 2) SAS
- Dominique Marais
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Electronic device comprising an encapsulating block locally of smal...

Electronic device comprising an encapsulating block locally of smal...

Dual side package on package

Process for producing electrical-connections on a semiconductor pac...

Process for producing electrical connections on the surface of a se...

Casing for integrated circuit chips and method of fabrication

Semiconductor package having mechanically and electrically bonded s...

Patents Applicationslast 30 patents

PACKAGE FOR INTEGRATED CIRCUIT WITH HEAT DISSIPATION

INTEGRATED CIRCUIT PACKAGES

ELECTRONIC DEVICE COMPRISING AN ENCAPSULATING BLOCK LOCALLY OF SMAL...

ELECTRONIC DEVICE COMPRISING AN ENCAPSULATING BLOCK LOCALLY OF SMAL...

DUAL SIDE PACKAGE ON PACKAGE