Ludan Huang

Person

Tigard, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 11,208,732
- Issue date Dec 28, 2021
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Monitoring surface oxide on seed layers during electroplating
- Patent number 10,443,146
- Issue date Oct 15, 2019
- Lam Research Corporation
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating semiconductor wafer when co...
- Patent number 9,816,196
- Issue date Nov 14, 2017
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Membrane design for reducing defects in electroplating systems
- Patent number 9,677,190
- Issue date Jun 13, 2017
- Lam Research Corporation
- Doyeon Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
IMPROVING SUBSTRATE WETTABILITY FOR PLATING OPERATIONS
- Publication number 20210366768
- Publication date Nov 25, 2021
- LAM RESEARCH CORPORATION
- Zhian HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20190390361
- Publication date Dec 26, 2019
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING
- Publication number 20180282894
- Publication date Oct 4, 2018
- LAM RESEARCH CORPORATION
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...
- Publication number 20180030611
- Publication date Feb 1, 2018
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR CHARACTERIZING METAL OXIDE REDUCTION
- Publication number 20160111342
- Publication date Apr 21, 2016
- LAM RESEARCH CORPORATION
- Ludan Huang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MEMBRANE DESIGN FOR REDUCING DEFECTS IN ELECTROPLATING SYSTEMS
- Publication number 20150122658
- Publication date May 7, 2015
- LAM RESEARCH CORPORATION
- Doyeon Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUSES AND METHODS EMPLOYING LIQUID PARTICLE CO...
- Publication number 20140001050
- Publication date Jan 2, 2014
- Ludan Huang
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...
- Publication number 20130284604
- Publication date Oct 31, 2013
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Ludan Huang

Person

Patents Grantslast 30 patents

Monitoring surface oxide on seed layers during electroplating

Monitoring surface oxide on seed layers during electroplating

Method and apparatus for electroplating semiconductor wafer when co...

Membrane design for reducing defects in electroplating systems

Patents Applicationslast 30 patents

IMPROVING SUBSTRATE WETTABILITY FOR PLATING OPERATIONS

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

MONITORING SURFACE OXIDE ON SEED LAYERS DURING ELECTROPLATING

METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...

METHOD AND APPARATUS FOR CHARACTERIZING METAL OXIDE REDUCTION

MEMBRANE DESIGN FOR REDUCING DEFECTS IN ELECTROPLATING SYSTEMS

ELECTROPLATING APPARATUSES AND METHODS EMPLOYING LIQUID PARTICLE CO...

METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...