Luke Garner

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Vias for package substrates
- Patent number 11,705,389
- Issue date Jul 18, 2023
- Intel Corporation
- Andrew J. Brown
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having sealant bridge
- Patent number 11,676,873
- Issue date Jun 13, 2023
- Intel Corporation
- Dinesh Padmanabhan Ramalekshmi Thanu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VIAS FOR PACKAGE SUBSTRATES
- Publication number 20200395282
- Publication date Dec 17, 2020
- Intel Corporation
- Andrew J. BROWN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING SEALANT BRIDGE
- Publication number 20200185290
- Publication date Jun 11, 2020
- Intel Corporation
- Dinesh PADMANABHAN RAMALEKSHMI THANU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWAGING PROCESS FOR COMPLEX INTEGRATED HEAT SPREADERS
- Publication number 20190043778
- Publication date Feb 7, 2019
- Zhizhong TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COOLING SOLUTION DESIGNS FOR MICROELECTRONIC PACKAGES
- Publication number 20190006259
- Publication date Jan 3, 2019
- Intel Corporation
- Dinesh Padmanabhan Ramalekshmi Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOADING MECHANISM FOR BARE DIE PACKAGES AND LGA SOCKET
- Publication number 20090085187
- Publication date Apr 2, 2009
- Ward Scott
- H01 - BASIC ELECTRIC ELEMENTS