Lumin Li

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi zone gas injection upper electrode system
- Patent number 11,594,400
- Issue date Feb 28, 2023
- Lam Research Corporation
- Ryan Bise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi zone gas injection upper electrode system
- Patent number 10,622,195
- Issue date Apr 14, 2020
- Lam Research Corporation
- Ryan Bise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual zone temperature control of upper electrodes
- Patent number 9,263,240
- Issue date Feb 16, 2016
- Lam Research Corporation
- Alexei Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for controlling plasma potential
- Patent number 9,111,724
- Issue date Aug 18, 2015
- Lam Research Corporation
- Douglas Keil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for controlling etch uniformity
- Patent number 8,674,255
- Issue date Mar 18, 2014
- Lam Research Corporation
- Eric Lenz
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for controlling plasma density profile
- Patent number 8,299,390
- Issue date Oct 30, 2012
- Lam Research Corporation
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum plasma processor having a chamber with electrodes and a coil...
- Patent number 8,114,246
- Issue date Feb 14, 2012
- Lam Research Corporation
- Tuqiang Ni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatuses for adjusting electrode gap in capacitively-coupled RF...
- Patent number 8,080,760
- Issue date Dec 20, 2011
- Lam Research Corporation
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck assembly with dielectric material and/or cavity...
- Patent number 8,000,082
- Issue date Aug 16, 2011
- Lam Research Corporation
- Rajinder Dhindsa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Method for plasma etching performance enhancement
- Patent number 7,977,390
- Issue date Jul 12, 2011
- Lam Research Corporation
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double mask self-aligned double patterning technology (SADPT) process
- Patent number 7,977,242
- Issue date Jul 12, 2011
- Lam Research Corporation
- S. M. Reza Sadjadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic enhancement for mechanical confinement of plasma
- Patent number 7,838,086
- Issue date Nov 23, 2010
- Lam Research Corporation
- Douglas L. Keil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio etch using modulation of RF powers of various fre...
- Patent number 7,749,353
- Issue date Jul 6, 2010
- Lam Research Corporation
- Camelia Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses for adjusting electrode gap in capacitively-coupled RF...
- Patent number 7,732,728
- Issue date Jun 8, 2010
- Lam Research Corporation
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for controlling plasma density profile
- Patent number 7,683,289
- Issue date Mar 23, 2010
- Lam Research Corporation
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrically enhancing the confinement of plasma
- Patent number 7,632,375
- Issue date Dec 15, 2009
- Lam Research Corporation
- Andras Kuthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chuck assembly with dielectric material and/or cavity...
- Patent number 7,525,787
- Issue date Apr 28, 2009
- Lam Research Corporation
- Rajinder Dhindsa
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Magnetic enhancement for mechanical confinement of plasma
- Patent number 7,455,748
- Issue date Nov 25, 2008
- Lam Research Corporation
- Douglas L. Keil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple frequency plasma processor method and apparatus
- Patent number 7,405,521
- Issue date Jul 29, 2008
- Lam Research Corporation
- Raj Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a dual damascene structure
- Patent number 7,169,695
- Issue date Jan 30, 2007
- Lam Research Corporation
- Zhisong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High aspect ratio etch using modulation of RF powers of various fre...
- Patent number 7,144,521
- Issue date Dec 5, 2006
- Lam Research Corporation
- Camelia Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum plasma processor having a chamber with electrodes and a coil...
- Patent number 7,105,102
- Issue date Sep 12, 2006
- Lam Research Corporation
- Tuqiang Ni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processor in plasma confinement region within a vacuum chamber
- Patent number 6,984,288
- Issue date Jan 10, 2006
- Lam Research Corporation
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plasma etching performance enhancement
- Patent number 6,833,325
- Issue date Dec 21, 2004
- Lam Research Corporation
- Zhisong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching of dielectric layer with etch profile control
- Patent number 6,746,961
- Issue date Jun 8, 2004
- Lam Research Corporation
- Tuqiang Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum plasma processor having a chamber with electrodes and a coil...
- Patent number 6,716,303
- Issue date Apr 6, 2004
- Lam Research Corporation
- Tuqiang Ni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Configurable plasma volume etch chamber
- Patent number 6,527,911
- Issue date Mar 4, 2003
- Lam Research Corporation
- Bi-Ming Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perforated plasma confinement ring in plasma reactors
- Patent number 6,506,685
- Issue date Jan 14, 2003
- Lam Research Corporation
- Lumin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Perforated plasma confinement ring in plasma reactors
- Patent number 6,178,919
- Issue date Jan 30, 2001
- Lam Research Corporation
- Lumin Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor process chamber electrode
- Patent number 6,106,663
- Issue date Aug 22, 2000
- Lam Research Corporation
- Andras Kuthi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI ZONE GAS INJECTION UPPER ELECTRODE SYSTEM
- Publication number 20200243307
- Publication date Jul 30, 2020
- LAM RESEARCH CORPORATION
- Ryan Bise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL ZONE TEMPERATURE CONTROL OF UPPER ELECTRODES
- Publication number 20130126476
- Publication date May 23, 2013
- LAM RESEARCH CORPORATION
- Alexei Marakhtanov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi Zone Gas Injection Upper Electrode System
- Publication number 20130126486
- Publication date May 23, 2013
- Ryan Bise
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Controlling Plasma Potential
- Publication number 20110024046
- Publication date Feb 3, 2011
- LAM RESEARCH CORPORATION
- Douglas Keil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Controlling Plasma Potential
- Publication number 20110024045
- Publication date Feb 3, 2011
- LAM RESEARCH CORPORATION
- Douglas Keil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Controlling Plasma Density Profile
- Publication number 20100126847
- Publication date May 27, 2010
- LAM RESEARCH CORPORATION
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES FOR ADJUSTING ELECTRODE GAP IN CAPACITIVELY-COUPLED RF...
- Publication number 20100124822
- Publication date May 20, 2010
- LAM RESEARCH CORPORATION
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE MASK SELF-ALIGNED DOUBLE PATTERNING TECHNOLOGY (SADPT) PROCESS
- Publication number 20090215272
- Publication date Aug 27, 2009
- LAM RESEARCH CORPORATION
- S. M. Reza Sadjadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCK ASSEMBLY WITH DIELECTRIC MATERIAL AND/OR CAVITY...
- Publication number 20090174983
- Publication date Jul 9, 2009
- LAM RESEARCH CORPORATION
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY ENHANCING THE CONFINEMENT OF PLASMA
- Publication number 20090165954
- Publication date Jul 2, 2009
- LAM RESEARCH CORPORATION
- Andras Kuthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC ENHANCEMENT FOR MECHANICAL CONFINEMENT OF PLASMA
- Publication number 20090041951
- Publication date Feb 12, 2009
- LAM RESEARCH CORPORATION
- Douglas L. Keil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatuses for adjusting electrode gap in capacitively-coupled RF...
- Publication number 20080171444
- Publication date Jul 17, 2008
- LAM RESEARCH CORPORATION
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and Method for Controlling Plasma Potential
- Publication number 20080006205
- Publication date Jan 10, 2008
- Douglas Keil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing line edge roughness
- Publication number 20070181530
- Publication date Aug 9, 2007
- Lam Research Corporation
- Zhi-Song Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for controlling plasma density profile
- Publication number 20070141729
- Publication date Jun 21, 2007
- LAM RESEARCH CORPORATION
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electrostatic chuck assembly with dielectric material and/or cavity...
- Publication number 20070076346
- Publication date Apr 5, 2007
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VACUUM PLASMA PROCESSOR HAVING A CHAMBER WITH ELECTRODES AND A COIL...
- Publication number 20070044915
- Publication date Mar 1, 2007
- LAM RESEARCH CORPORATION
- Tuqiang Ni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for plasma etching performance enhancement
- Publication number 20070026677
- Publication date Feb 1, 2007
- Lam Research Corporation
- Bing Ji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High aspect ratio etch using modulation of RF powers of various fre...
- Publication number 20070012659
- Publication date Jan 18, 2007
- Lam Research Corporation
- Camelia Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High aspect ratio etch using modulation of RF powers of various fre...
- Publication number 20060118518
- Publication date Jun 8, 2006
- Lam Research Corporation
- Camelia Rusu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple frequency plasma etch reactor
- Publication number 20050039682
- Publication date Feb 24, 2005
- Raj Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for plasma etching performance enhancement
- Publication number 20050037624
- Publication date Feb 17, 2005
- Lam Research Corporation
- Zhisong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Magnetic enhancement for mechanical confinement of plasma
- Publication number 20050006028
- Publication date Jan 13, 2005
- Lam Research Corporation
- Douglas L. Keil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor process chamber electrode
- Publication number 20040173159
- Publication date Sep 9, 2004
- LAM RESEARCH CORPORATION
- Andras Kuthi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vacuum plasma processor having a chamber with electrodes and a coil...
- Publication number 20040154747
- Publication date Aug 12, 2004
- Lam Research Corporation
- Tuqiang Ni
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method for forming a dual damascene structure
- Publication number 20040072430
- Publication date Apr 15, 2004
- Zhisong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for plasma etching performance enhancement
- Publication number 20040072443
- Publication date Apr 15, 2004
- Lam Research Corporation
- Zhisong Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma etching of dielectric layer with etch profile control
- Publication number 20030045114
- Publication date Mar 6, 2003
- Tuqiang Ni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual frequency plasma processor
- Publication number 20030029567
- Publication date Feb 13, 2003
- Rajinder Dhindsa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Perforated plasma confinement ring in plasma reactors
- Publication number 20010000104
- Publication date Apr 5, 2001
- Lumin Li
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Multi zone gas injection upper electrode system

Multi zone gas injection upper electrode system

Dual zone temperature control of upper electrodes

Apparatus and method for controlling plasma potential

Apparatus and method for controlling etch uniformity

Apparatus and method for controlling plasma density profile

Vacuum plasma processor having a chamber with electrodes and a coil...

Apparatuses for adjusting electrode gap in capacitively-coupled RF...

Electrostatic chuck assembly with dielectric material and/or cavity...

Method for plasma etching performance enhancement

Double mask self-aligned double patterning technology (SADPT) process

Magnetic enhancement for mechanical confinement of plasma

High aspect ratio etch using modulation of RF powers of various fre...

Apparatuses for adjusting electrode gap in capacitively-coupled RF...

Apparatus and method for controlling plasma density profile

Electrically enhancing the confinement of plasma

Electrostatic chuck assembly with dielectric material and/or cavity...

Magnetic enhancement for mechanical confinement of plasma

Multiple frequency plasma processor method and apparatus

Method for forming a dual damascene structure

High aspect ratio etch using modulation of RF powers of various fre...

Vacuum plasma processor having a chamber with electrodes and a coil...

Plasma processor in plasma confinement region within a vacuum chamber

Method for plasma etching performance enhancement

Plasma etching of dielectric layer with etch profile control

Vacuum plasma processor having a chamber with electrodes and a coil...

Configurable plasma volume etch chamber

Perforated plasma confinement ring in plasma reactors

Perforated plasma confinement ring in plasma reactors

Semiconductor process chamber electrode

Patents Applicationslast 30 patents

MULTI ZONE GAS INJECTION UPPER ELECTRODE SYSTEM

DUAL ZONE TEMPERATURE CONTROL OF UPPER ELECTRODES

Multi Zone Gas Injection Upper Electrode System

Apparatus and Method for Controlling Plasma Potential

Apparatus and Method for Controlling Plasma Potential

Apparatus and Method for Controlling Plasma Density Profile

APPARATUSES FOR ADJUSTING ELECTRODE GAP IN CAPACITIVELY-COUPLED RF...

DOUBLE MASK SELF-ALIGNED DOUBLE PATTERNING TECHNOLOGY (SADPT) PROCESS

ELECTROSTATIC CHUCK ASSEMBLY WITH DIELECTRIC MATERIAL AND/OR CAVITY...

ELECTRICALLY ENHANCING THE CONFINEMENT OF PLASMA

MAGNETIC ENHANCEMENT FOR MECHANICAL CONFINEMENT OF PLASMA

Apparatuses for adjusting electrode gap in capacitively-coupled RF...

Apparatus and Method for Controlling Plasma Potential

Reducing line edge roughness

Apparatus and method for controlling plasma density profile

Electrostatic chuck assembly with dielectric material and/or cavity...

VACUUM PLASMA PROCESSOR HAVING A CHAMBER WITH ELECTRODES AND A COIL...

Method for plasma etching performance enhancement

High aspect ratio etch using modulation of RF powers of various fre...

High aspect ratio etch using modulation of RF powers of various fre...

Multiple frequency plasma etch reactor

Method for plasma etching performance enhancement

Magnetic enhancement for mechanical confinement of plasma

Semiconductor process chamber electrode

Vacuum plasma processor having a chamber with electrodes and a coil...

Method for forming a dual damascene structure

Method for plasma etching performance enhancement

Plasma etching of dielectric layer with etch profile control

Dual frequency plasma processor

Perforated plasma confinement ring in plasma reactors