Lung-Hua Ho

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 12,224,183
- Issue date Feb 11, 2025
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 11,651,974
- Issue date May 16, 2023
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 9,159,660
- Issue date Oct 13, 2015
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method and semiconductor structure thereof
- Patent number 9,059,260
- Issue date Jun 16, 2015
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing method and semiconductor structure thereof
- Patent number 8,823,169
- Issue date Sep 2, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier with three-dimensional capacitor
- Patent number 8,772,644
- Issue date Jul 8, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and lead frame thereof
- Patent number 8,704,345
- Issue date Apr 22, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pyramid bump structure
- Patent number 8,692,390
- Issue date Apr 8, 2014
- Chipbond Technology Corporation
- Chih-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and method for making the same
- Patent number 8,658,466
- Issue date Feb 25, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process and structure thereof
- Patent number 8,658,528
- Issue date Feb 25, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 8,581,384
- Issue date Nov 12, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming an anti-oxidant metal layer on an electronic de...
- Patent number 8,450,049
- Issue date May 28, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping process and structure thereof
- Patent number 8,415,243
- Issue date Apr 9, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240194646
- Publication date Jun 13, 2024
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF
- Publication number 20230378044
- Publication date Nov 23, 2023
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230187378
- Publication date Jun 15, 2023
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230170301
- Publication date Jun 1, 2023
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20230135424
- Publication date May 4, 2023
- Chipbond Technology Corporation
- Shrane-Ning Jenq
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220336233
- Publication date Oct 20, 2022
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20220037166
- Publication date Feb 3, 2022
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF
- Publication number 20140217578
- Publication date Aug 7, 2014
- Chipbond Technology Corporation
- Lung-Hua Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
- Publication number 20140141606
- Publication date May 22, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
- Publication number 20140117540
- Publication date May 1, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PAC...
- Publication number 20140120715
- Publication date May 1, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
- Publication number 20140035126
- Publication date Feb 6, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PAC...
- Publication number 20140035125
- Publication date Feb 6, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20140027905
- Publication date Jan 30, 2014
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF
- Publication number 20140021601
- Publication date Jan 23, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER WITH THREE-DIMENSIONAL CAPACITOR
- Publication number 20140008111
- Publication date Jan 9, 2014
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREOF
- Publication number 20130334671
- Publication date Dec 19, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME
- Publication number 20130334681
- Publication date Dec 19, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20130249070
- Publication date Sep 26, 2013
- Chipbond Technology Corporation
- Chin-Tang Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
- Publication number 20130193570
- Publication date Aug 1, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
- Publication number 20130196498
- Publication date Aug 1, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING PROCESS AND STRUCTURE THEREOF
- Publication number 20130181346
- Publication date Jul 18, 2013
- Chipbond Technology Corporation
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PYRAMID BUMP STRUCTURE
- Publication number 20120211257
- Publication date Aug 23, 2012
- Chih-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FORMING AN ANTI-OXIDANT METAL LAYER ON AN ELECTRONIC DE...
- Publication number 20120208129
- Publication date Aug 16, 2012
- Chih-Ming Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Lung-Hua Ho

Person

Patents Grantslast 30 patents

Method of manufacturing semiconductor device

Semiconductor package and method of fabricating the same

Semiconductor package structure and method for making the same

Semiconductor manufacturing method and semiconductor structure thereof

Semiconductor manufacturing method and semiconductor structure thereof

Carrier with three-dimensional capacitor

Semiconductor package and lead frame thereof

Pyramid bump structure

Semiconductor package structure and method for making the same

Bumping process and structure thereof

Semiconductor package structure

Process for forming an anti-oxidant metal layer on an electronic de...

Bumping process and structure thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

FLIP-CHIP BONDING STRUCTURE AND SUBSTRATE THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND METHOD OF MANUFACTURING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF

SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PAC...

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF

SEMICONDUCTOR MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE AND PAC...

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR MANUFACTURING METHOD AND SEMICONDUCTOR STRUCTURE THEREOF

CARRIER WITH THREE-DIMENSIONAL CAPACITOR

SEMICONDUCTOR PACKAGE AND LEAD FRAME THEREOF

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MAKING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE

BUMPING PROCESS AND STRUCTURE THEREOF

BUMPING PROCESS AND STRUCTURE THEREOF

BUMPING PROCESS AND STRUCTURE THEREOF

PYRAMID BUMP STRUCTURE

PROCESS FOR FORMING AN ANTI-OXIDANT METAL LAYER ON AN ELECTRONIC DE...