Luping Huang

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Dublin, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods and systems for chucking a warped wafer
- Patent number 10,468,288
- Issue date Nov 5, 2019
- KLA-Tencor Corporation
- Aviv Balan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for chucking warped wafers
- Patent number 10,381,256
- Issue date Aug 13, 2019
- KLA-Tencor Corporation
- Pradeep Subrahmanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chucking warped wafer with bellows
- Patent number 9,960,070
- Issue date May 1, 2018
- KLA-Tencor Corporation
- Luping Huang
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
System and method for non-contact wafer chucking
- Patent number 9,653,338
- Issue date May 16, 2017
- KLA-Tencor Corporation
- Luping Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods and Systems for Chucking a Warped Wafer
- Publication number 20180108559
- Publication date Apr 19, 2018
- KLA-Tencor Corporation
- Aviv Balan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR CHUCKING WARPED WAFERS
- Publication number 20160268156
- Publication date Sep 15, 2016
- KLA-Tencor Corporation
- Pradeep Subrahmanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHUCKING WARPED WAFER WITH BELLOWS
- Publication number 20160163580
- Publication date Jun 9, 2016
- KLA-Tencor Corporation
- Luping HUANG
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
System and Method for Non-Contact Wafer Chucking
- Publication number 20150179495
- Publication date Jun 25, 2015
- KLA-Tencor Corporation
- Luping Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR