Lutz Stamp

Person

Berlin, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Process for depositing a metal or metal alloy on a surface of a sub...
- Patent number 10,975,474
- Issue date Apr 13, 2021
- Atotech Deutschland GmbH
- Christian Wendeln
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Adhesion promoting agents for metallization of substrate surfaces
- Patent number 9,920,432
- Issue date Mar 20, 2018
- Atotech Deutschland GmbH
- Thomas Thomas
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for metallizing insulating substrates wherein the roughening...
- Patent number 8,137,575
- Issue date Mar 20, 2012
- Atotech Deutschland GmbH
- Merten Piel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Direct electrolytic metallization on non-conducting substrates
- Patent number 7,025,867
- Issue date Apr 11, 2006
- Atotech Deutschland GmbH
- Regina Czeczka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Palladium colloid solution and its utilization
- Patent number 6,325,910
- Issue date Dec 4, 2001
- Atotch Deutschland GmbH
- Heinrich Meyer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Complex oligomeric or polymeric compounds for the generation of met...
- Patent number 5,503,877
- Issue date Apr 2, 1996
- Atotech Deutschalnd GmbH
- Lutz Stamp
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for the metallization of nonconductive substrates with elim...
- Patent number 5,421,989
- Issue date Jun 6, 1995
- Atotech Deutschland GmbH
- Lutz Stamp
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
A METHOD FOR ACTIVATING A SURFACE OF A NON-CONDUCTIVE OR CARBON-FIB...
- Publication number 20220154343
- Publication date May 19, 2022
- Atotech Deutschland GmbH
- Josef GAIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROCESS FOR DEPOSITING A METAL OR METAL ALLOY ON A SURFACE OF A SUB...
- Publication number 20190169751
- Publication date Jun 6, 2019
- Atotech Deutschland GmbH
- Christian WENDELN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR TREATMENT OF RECESSED STRUCTURES IN DIELECTRIC MATERIALS...
- Publication number 20160205783
- Publication date Jul 14, 2016
- Atotech Deutschland GmbH
- Edith Steinhäuser
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
NOVEL ADHESION PROMOTING AGENTS FOR METALLIZATION OF SUBSTRATE SURF...
- Publication number 20140370313
- Publication date Dec 18, 2014
- Thomas Thomas
- B82 - NANO-TECHNOLOGY
Information Patent Application
FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION
- Publication number 20140242264
- Publication date Aug 28, 2014
- Atotech Deutschland GmbH
- Edith Stenhäuser
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR METALLIZING INSULATING SUBSTRATES WHEREIN THE ROUGHENING...
- Publication number 20090200263
- Publication date Aug 13, 2009
- Atotech Deutschland GmbH
- Merten Piel
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Direct electrolytic metallization on non-conducting substrates
- Publication number 20040112755
- Publication date Jun 17, 2004
- Regina Czeczka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Person

Patents Grantslast 30 patents

Process for depositing a metal or metal alloy on a surface of a sub...

Adhesion promoting agents for metallization of substrate surfaces

Method for metallizing insulating substrates wherein the roughening...

Direct electrolytic metallization on non-conducting substrates

Palladium colloid solution and its utilization

Complex oligomeric or polymeric compounds for the generation of met...

Process for the metallization of nonconductive substrates with elim...

Patents Applicationslast 30 patents

A METHOD FOR ACTIVATING A SURFACE OF A NON-CONDUCTIVE OR CARBON-FIB...

PROCESS FOR DEPOSITING A METAL OR METAL ALLOY ON A SURFACE OF A SUB...

METHOD FOR TREATMENT OF RECESSED STRUCTURES IN DIELECTRIC MATERIALS...

NOVEL ADHESION PROMOTING AGENTS FOR METALLIZATION OF SUBSTRATE SURF...

FORMALDEHYDE-FREE ELECTROLESS COPPER PLATING SOLUTION

METHOD FOR METALLIZING INSULATING SUBSTRATES WHEREIN THE ROUGHENING...

Direct electrolytic metallization on non-conducting substrates