LY HOON KHOO

Person

PETALING JAYA, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate with reservoir for die attach adhesive
- Patent number 10,325,826
- Issue date Jun 18, 2019
- NXP USA, INC.
- Ly Hoon Khoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal BGA substrate
- Patent number 9,698,093
- Issue date Jul 4, 2017
- NXP USA,INC.
- Chee Seng Foong
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Multi-use substrate for integrated circuit
- Patent number 9,190,355
- Issue date Nov 17, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Hoong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated lead frame bond finger
- Patent number 9,129,951
- Issue date Sep 8, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Seng Kiong Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with corner tie bars
- Patent number 9,000,570
- Issue date Apr 7, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Hoong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid lead frame and ball grid array package
- Patent number 8,987,881
- Issue date Mar 24, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Seng Kiong Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor device
- Patent number 8,283,780
- Issue date Oct 9, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELIMINATING SUBSTRATE METAL CRACKS IN A BALL GRID ARRAY PACKAGE
- Publication number 20240203905
- Publication date Jun 20, 2024
- NXP USA, Inc.
- Swee Yean Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT WITH ON-DIE POWER DISTRIBUTION BARS
- Publication number 20170062311
- Publication date Mar 2, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Chee Seng Foong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL BGA SUBSTRATE
- Publication number 20170062320
- Publication date Mar 2, 2017
- FREESCALE SEMICONDUCTOR, INC.
- CHEE SENG FOONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-USE SUBSTRATE FOR INTEGRATED CIRCUIT
- Publication number 20150303137
- Publication date Oct 22, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Weng Hoong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH INTERIOR LEADS
- Publication number 20150206829
- Publication date Jul 23, 2015
- Yin Kheng Au
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED LEAD FRAME BOND FINGER
- Publication number 20150108623
- Publication date Apr 23, 2015
- Seng Kiong Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID LEAD FRAME AND BALL GRID ARRAY PACKAGE
- Publication number 20150014834
- Publication date Jan 15, 2015
- Seng Kiong Teng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CORNER TIE BARS
- Publication number 20150014831
- Publication date Jan 15, 2015
- Weng Hoong Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE MOUNT SEMICONDUCTOR DEVICE
- Publication number 20120133053
- Publication date May 31, 2012
- FREESCALE SEMICONDUCTOR, INC.
- Wai Yew Lo
- H01 - BASIC ELECTRIC ELEMENTS

LY HOON KHOO

Person

Patents Grantslast 30 patents

Substrate with reservoir for die attach adhesive

Universal BGA substrate

Multi-use substrate for integrated circuit

Coated lead frame bond finger

Semiconductor device with corner tie bars

Hybrid lead frame and ball grid array package

Surface mount semiconductor device

Patents Applicationslast 30 patents

ELIMINATING SUBSTRATE METAL CRACKS IN A BALL GRID ARRAY PACKAGE

INTEGRATED CIRCUIT WITH ON-DIE POWER DISTRIBUTION BARS

UNIVERSAL BGA SUBSTRATE

MULTI-USE SUBSTRATE FOR INTEGRATED CIRCUIT

SEMICONDUCTOR PACKAGE WITH INTERIOR LEADS

COATED LEAD FRAME BOND FINGER

HYBRID LEAD FRAME AND BALL GRID ARRAY PACKAGE

SEMICONDUCTOR DEVICE WITH CORNER TIE BARS

SURFACE MOUNT SEMICONDUCTOR DEVICE