Lye-King Tan

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Method to form multi-material components
- Patent number 7,347,968
- Issue date Mar 25, 2008
- Advanced Materials Technology Pte. Ltd.
- Kay Leong Lim
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Advanced microelectronic heat dissipation package and method for it...
- Patent number 6,935,022
- Issue date Aug 30, 2005
- Advanced Materials Technologies Pte, Ltd.
- Randall M. German
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Net shaped articles having complex internal undercut features
- Patent number 6,776,955
- Issue date Aug 17, 2004
- Advanced Materials Technologies, Pte., Ltd.
- Kay-Leong Lim
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Forming complex-shaped aluminum components
- Patent number 6,761,852
- Issue date Jul 13, 2004
- Advanced Materials Technologies Pte. Ltd.
- Chee-Tian Yeo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method to form multi-material components
- Patent number 6,660,225
- Issue date Dec 9, 2003
- Advanced Materials Technologies Pte, Ltd.
- Kay Leong Lim
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Enclosure for a semiconductor device
- Patent number 6,569,380
- Issue date May 27, 2003
- Advanced Materials Technologies Pte, Ltd.
- Kay-Leong Lim
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method to form multi-material components
- Patent number 6,461,563
- Issue date Oct 8, 2002
- Advanced Materials Technologies Pte. Ltd.
- Kay-Leong Lim
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Grant
Non-magnetic, high density alloy
- Patent number 6,045,601
- Issue date Apr 4, 2000
- Advanced Materials Technologies, Pte, Ltd.
- Lye King Tan
- F42 - AMMUNITION BLASTING

Patents Applicationslast 30 patents

Information Patent Application
Advanced microelectronic heat dissipation package and method for it...
- Publication number 20060000584
- Publication date Jan 5, 2006
- ADVANCED MATERIALS TECHNOLOGY PTE. LTD.
- Randall M. German
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Advanced microelectronic heat dissipation package and method for it...
- Publication number 20050284616
- Publication date Dec 29, 2005
- ADVANCED MATERIALS TECHNOLOGY PTE. LTD.
- Randall M. German
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Method to form multi-material components
- Publication number 20040086414
- Publication date May 6, 2004
- ADVANCED MATERIALS TECHNOLOGY PTE. LTD.
- Kay Leong Lim
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Method to form multi-material components
- Publication number 20040071581
- Publication date Apr 15, 2004
- ADVANCED MATERIALS TECHNOLOGY PTE. LTD.
- Kay Leong Lim
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
Forming complex-shaped aluminum components
- Publication number 20030170137
- Publication date Sep 11, 2003
- Advanced Materials Technologies Pte. Ltd.
- Chee-Tian Yeo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Advanced microelectronic heat dissipation package and method for it...
- Publication number 20030042006
- Publication date Mar 6, 2003
- Advanced Materials Technologies Pte. Ltd.
- Randall M. German
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Enclosure for a semiconductor device
- Publication number 20030039571
- Publication date Feb 27, 2003
- Advanced Materials Technologies Pte., Ltd
- Kay-Leong Lim
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Method to form multi-material components
- Publication number 20020071781
- Publication date Jun 13, 2002
- Advanced Materials Technologies Pte., Ltd
- Kay Leong Lim
- B22 - CASTING POWDER METALLURGY

Lye-King Tan

Person

Patents Grantslast 30 patents

Method to form multi-material components

Advanced microelectronic heat dissipation package and method for it...

Net shaped articles having complex internal undercut features

Forming complex-shaped aluminum components

Method to form multi-material components

Enclosure for a semiconductor device

Method to form multi-material components

Non-magnetic, high density alloy

Patents Applicationslast 30 patents

Advanced microelectronic heat dissipation package and method for it...

Advanced microelectronic heat dissipation package and method for it...

Method to form multi-material components

Method to form multi-material components

Forming complex-shaped aluminum components

Advanced microelectronic heat dissipation package and method for it...

Enclosure for a semiconductor device

Method to form multi-material components