Lynda Boutin

Follow

Person

Waterloo, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Transfer molding method for forming integrated circuit package
- Patent number 6,309,575
- Issue date Oct 30, 2001
- International Business Machines Corporation
- Lynda Boutin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip package
- Patent number 5,939,778
- Issue date Aug 17, 1999
- International Business Machines Corporation
- Lynda Boutin
- H01 - BASIC ELECTRIC ELEMENTS