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M. Lawrence A. Dass
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Fremont, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated passivation process, probe geometry and probing process
Patent number
6,515,358
Issue date
Feb 4, 2003
Intel Corporation
M. Lawrence A. Dass
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method and apparatus for cutting a wafer
Patent number
6,357,330
Issue date
Mar 19, 2002
Intel Corporation
M. Lawrence A. Dass
B28 - WORKING CEMENT, CLAY, OR STONE
Information
Patent Grant
Semiconductor passivation deposition process for interfacial adhesion
Patent number
6,352,940
Issue date
Mar 5, 2002
Intel Corporation
Krishna Seshan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for sort testing C4 bumped wafers
Patent number
6,162,652
Issue date
Dec 19, 2000
Intel Corporation
M. Lawrence A. Dass
G01 - MEASURING TESTING
Information
Patent Grant
KLXX technology with integrated passivation process, probe geometry...
Patent number
6,143,668
Issue date
Nov 7, 2000
Intel Corporation
M. Lawrence A. Dass
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Passivation technology combining improved adhesion in passivation a...
Patent number
6,046,101
Issue date
Apr 4, 2000
Intel Corporation
M. Lawrence A. Dass
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for formation of epitaxial cobalt silicide and shallow junc...
Patent number
5,536,684
Issue date
Jul 16, 1996
Intel Corporation
M. Lawrence A. Dass
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor passivation deposition process for interfacial adhesion
Publication number
20020050629
Publication date
May 2, 2002
Krishna Seshan
H01 - BASIC ELECTRIC ELEMENTS