Ma Phoo Pwint Hlaing

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming EWLB semiconductor packa...
- Patent number 9,620,557
- Issue date Apr 11, 2017
- STATS ChipPAC Pte. Ltd.
- Seng Guan Chow
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 9,397,058
- Issue date Jul 19, 2016
- STATS ChipPAC Pte. Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming EWLB semiconductor packa...
- Patent number 9,252,172
- Issue date Feb 2, 2016
- STATS ChipPAC, Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming openings through encapsu...
- Patent number 9,171,769
- Issue date Oct 27, 2015
- STATS ChipPAC, Ltd.
- Seng Guan Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming RDL under bump for elect...
- Patent number 9,142,522
- Issue date Sep 22, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming patterned repassivation...
- Patent number 8,963,326
- Issue date Feb 24, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming EWLB Semiconductor Packa...
- Publication number 20160104731
- Publication date Apr 14, 2016
- STATS ChipPAC, Ltd.
- Seng Guan Chow
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20150091165
- Publication date Apr 2, 2015
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Patterned Repassivation...
- Publication number 20130140691
- Publication date Jun 6, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming RDL Under Bump for Elect...
- Publication number 20130134580
- Publication date May 30, 2013
- STATS ChipPAC, Ltd.
- Xusheng Bao
- H01 - BASIC ELECTRIC ELEMENTS