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Ma. Shirley Asoy
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Integrated circuit package system with filled wafer recess
Patent number
8,293,584
Issue date
Oct 23, 2012
Stats Chippac Ltd.
Dennis Guillermo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package-on-package stacking system
Patent number
7,868,434
Issue date
Jan 11, 2011
Stats Chippac Ltd.
Dioscoro A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of laser-marking wafers with tape a...
Patent number
7,829,384
Issue date
Nov 9, 2010
STATS ChipPAC, Ltd.
Glenn Omandam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package-on-package stacking system and method of...
Patent number
7,718,472
Issue date
May 18, 2010
Stats Chippac Ltd.
Dioscoro A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package-on-package stacking system
Patent number
7,535,086
Issue date
May 19, 2009
Stats Chippac Ltd.
Dioscoro A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
Publication number
20100176497
Publication date
Jul 15, 2010
Dioscoro A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
Publication number
20090179312
Publication date
Jul 16, 2009
Dioscoro A. Merilo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Laser-Marking Wafers with Tape A...
Publication number
20090081830
Publication date
Mar 26, 2009
STATS ChipPAC, Ltd.
Glenn Omandam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FILLED RECESS
Publication number
20080029847
Publication date
Feb 7, 2008
STATS ChipPAC Ltd.
Dennis Guillermo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE-ON-PACKAGE STACKING SYSTEM
Publication number
20080029858
Publication date
Feb 7, 2008
STATS ChipPAC Ltd.
Dioscoro A. Merilo
H01 - BASIC ELECTRIC ELEMENTS