Madhav Datta

Person

Yorktown Hts, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for testing chips on flat solder bumps
- Patent number 6,656,750
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Madhav Datta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow of low melt solder tip C4's
- Patent number 6,258,703
- Issue date Jul 10, 2001
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for monitoring components in the TiW etching bath used in t...
- Patent number 6,238,589
- Issue date May 29, 2001
- International Business Machines Corporation
- Emanuel Israel Cooper
- G01 - MEASURING TESTING
Information Patent Grant
Removal of metal skin from a copper-Invar-copper laminate
- Patent number 6,228,246
- Issue date May 8, 2001
- International Business Machines Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Flip-Chip interconnections using lead-free solders
- Patent number 6,224,690
- Issue date May 1, 2001
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for the electrochemical etching of a wafer
- Patent number 6,103,096
- Issue date Aug 15, 2000
- International Business Machines Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
High performance lithium polymer electrolyte battery
- Patent number 6,030,728
- Issue date Feb 29, 2000
- International Business Machines Corporation
- John M. Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High energy density, flexible lithium primary batteries
- Patent number 5,989,751
- Issue date Nov 23, 1999
- International Business Machines Corporation
- John M. Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithium polymer electrolyte battery for sub-ambient temperature app...
- Patent number 5,939,223
- Issue date Aug 17, 1999
- International Business Machines Corporation
- John M. Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier layers for electroplated SnPb eutectic solder joints
- Patent number 5,937,320
- Issue date Aug 10, 1999
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical etching apparatus and method for spirally etching a...
- Patent number 5,865,984
- Issue date Feb 2, 1999
- International Business Machines Corporation
- William E. Corbin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Selective chemical etching in microelectronics fabrication
- Patent number 5,800,726
- Issue date Sep 1, 1998
- International Business Machines Corporation
- John Michael Cotte
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metallic interconnect pad, and integrated circuit structure using s...
- Patent number 5,796,168
- Issue date Aug 18, 1998
- International Business Machines Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching of Ti-W for C4 rework
- Patent number 5,759,437
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Madhav Datta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method to improve uniformity and reduce excess undercuts during che...
- Patent number 5,620,611
- Issue date Apr 15, 1997
- International Business Machines Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tool and method for electroetching
- Patent number 5,614,076
- Issue date Mar 25, 1997
- International Business Machines Corporation
- Denis J. Brophy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical metal removal technique for planarization of surfaces
- Patent number 5,567,300
- Issue date Oct 22, 1996
- IBM Corporation
- Madhav Datta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Elimination of island formation and contact resistance problems dur...
- Patent number 5,567,304
- Issue date Oct 22, 1996
- IBM Corporation
- Madhav Datta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a thin flexible primary battery for microelectron...
- Patent number 5,558,957
- Issue date Sep 24, 1996
- International Business Machines Corporation
- Madhav Datta
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electroetching method and apparatus
- Patent number 5,543,032
- Issue date Aug 6, 1996
- IBM Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Vertical electroetch tool nozzle and method
- Patent number 5,536,388
- Issue date Jul 16, 1996
- International Business Machines Corporation
- Thomas E. Dinan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroetching tool using localized application of channelized flow...
- Patent number 5,531,874
- Issue date Jul 2, 1996
- International Business Machines Corporation
- Denis J. Brophy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroetching process for seed layer removal in electrochemical fa...
- Patent number 5,486,282
- Issue date Jan 23, 1996
- IBM Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Fabrication of moly masks by electroetching
- Patent number 5,476,575
- Issue date Dec 19, 1995
- International Business Machines Corporation
- Denis J. Brophy
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Selective etching of TiW for C4 fabrication
- Patent number 5,462,638
- Issue date Oct 31, 1995
- International Business Machines Corporation
- Madhav Datta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for contactless real-time in-situ monitoring o...
- Patent number 5,456,788
- Issue date Oct 10, 1995
- International Business Machines Corporation
- Steven G. Barbee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for contactless real-time in-situ monitoring o...
- Patent number 5,445,705
- Issue date Aug 29, 1995
- International Business Machines Corporation
- Steven G. Barbee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical micromachining tool and process for through-mask pa...
- Patent number 5,284,554
- Issue date Feb 8, 1994
- International Business Machines Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Etching processes for avoiding edge stress in semiconductor chip so...
- Patent number 5,268,072
- Issue date Dec 7, 1993
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical tool for uniform metal removal during electropolishing
- Patent number 5,217,586
- Issue date Jun 8, 1993
- International Business Machines Corporation
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
Method for testing chips on flat solder bumps
- Publication number 20040087046
- Publication date May 6, 2004
- International Business Machines Corporation
- Madhav Datta
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reflow of low melt solder tip C4's
- Publication number 20020009869
- Publication date Jan 24, 2002
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS

Madhav Datta

Person

Patents Grantslast 30 patents

Method for testing chips on flat solder bumps

Reflow of low melt solder tip C4&#x00027;s

Methods for monitoring components in the TiW etching bath used in t...

Removal of metal skin from a copper-Invar-copper laminate

Flip-Chip interconnections using lead-free solders

Apparatus and method for the electrochemical etching of a wafer

High performance lithium polymer electrolyte battery

High energy density, flexible lithium primary batteries

Lithium polymer electrolyte battery for sub-ambient temperature app...

Barrier layers for electroplated SnPb eutectic solder joints

Electrochemical etching apparatus and method for spirally etching a...

Selective chemical etching in microelectronics fabrication

Metallic interconnect pad, and integrated circuit structure using s...

Etching of Ti-W for C4 rework

Method to improve uniformity and reduce excess undercuts during che...

Tool and method for electroetching

Electrochemical metal removal technique for planarization of surfaces

Elimination of island formation and contact resistance problems dur...

Method for making a thin flexible primary battery for microelectron...

Electroetching method and apparatus

Vertical electroetch tool nozzle and method

Electroetching tool using localized application of channelized flow...

Electroetching process for seed layer removal in electrochemical fa...

Fabrication of moly masks by electroetching

Selective etching of TiW for C4 fabrication

Method and apparatus for contactless real-time in-situ monitoring o...

Method and apparatus for contactless real-time in-situ monitoring o...

Electrochemical micromachining tool and process for through-mask pa...

Etching processes for avoiding edge stress in semiconductor chip so...

Electrochemical tool for uniform metal removal during electropolishing

Patents Applicationslast 30 patents

Method for testing chips on flat solder bumps

Reflow of low melt solder tip C4's

Reflow of low melt solder tip C4's