Madhav Datta

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 10,037,956
- Issue date Jul 31, 2018
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 8,952,550
- Issue date Feb 10, 2015
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 7,250,678
- Issue date Jul 31, 2007
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 7,196,001
- Issue date Mar 27, 2007
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of electroless introduction of interconnect structures
- Patent number 6,977,224
- Issue date Dec 20, 2005
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ball-limiting metallurgy etching processes for fabricatio...
- Patent number 6,917,106
- Issue date Jul 12, 2005
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under bump metallurgy for Lead-Tin bump over copper pad
- Patent number 6,878,465
- Issue date Apr 12, 2005
- Intel Corporation
- Peter K. Moon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Patent number 6,853,076
- Issue date Feb 8, 2005
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective ball-limiting metallurgy etching processes for fabricatio...
- Patent number 6,750,133
- Issue date Jun 15, 2004
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...
- Patent number 6,740,427
- Issue date May 25, 2004
- Intel Corporation
- Madhav Datta
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Under bump metallurgy for lead-tin bump over copper pad
- Patent number 6,703,069
- Issue date Mar 9, 2004
- Intel Corporation
- Peter K. Moon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnect structures and a method of electroless introduction of...
- Patent number 6,696,758
- Issue date Feb 24, 2004
- Intel Corporation
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPPER-CONTAINING C4 BALL-LIMITING METALLURGY STACK FOR ENHANCED RE...
- Publication number 20170141062
- Publication date May 18, 2017
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER-CONTAINING C4 BALL-LIMITING METALLURGY STACK FOR ENHANCED RE...
- Publication number 20150132940
- Publication date May 14, 2015
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20100117229
- Publication date May 13, 2010
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20060148233
- Publication date Jul 6, 2006
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective ball-limiting metallurgy etching processes for fabricatio...
- Publication number 20040224491
- Publication date Nov 11, 2004
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20040159947
- Publication date Aug 19, 2004
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20040159944
- Publication date Aug 19, 2004
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE BALL-LIMITING METALLURGY ETCHING PROCESSES FOR FABRICATIO...
- Publication number 20040080024
- Publication date Apr 29, 2004
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Under bump metallurgy for Lead-Tin bump over copper pad
- Publication number 20040060970
- Publication date Apr 1, 2004
- Peter K. Moon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrochemical/ mechanical polishing
- Publication number 20030205484
- Publication date Nov 6, 2003
- Madhav Datta
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Interconnect structures and a method of electroless introduction of...
- Publication number 20030071355
- Publication date Apr 17, 2003
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper-containing C4 ball-limiting metallurgy stack for enhanced re...
- Publication number 20030057551
- Publication date Mar 27, 2003
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...
- Publication number 20030059644
- Publication date Mar 27, 2003
- Intel Corporation
- Madhav Datta
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Dual-stack, ball-limiting metallurgy and method of making same
- Publication number 20030060041
- Publication date Mar 27, 2003
- Intel Corporation
- Madhav Datta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnect structures and a method of electroless introduction of...
- Publication number 20020084529
- Publication date Jul 4, 2002
- Valery M. Dubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroless method of seed layer depostion, repair, and fabrication...
- Publication number 20020064592
- Publication date May 30, 2002
- Madhav Datta
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Madhav Datta

Person

Patents Grantslast 30 patents

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Method of electroless introduction of interconnect structures

Selective ball-limiting metallurgy etching processes for fabricatio...

Under bump metallurgy for Lead-Tin bump over copper pad

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Selective ball-limiting metallurgy etching processes for fabricatio...

Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...

Under bump metallurgy for lead-tin bump over copper pad

Interconnect structures and a method of electroless introduction of...

Patents Applicationslast 30 patents

COPPER-CONTAINING C4 BALL-LIMITING METALLURGY STACK FOR ENHANCED RE...

COPPER-CONTAINING C4 BALL-LIMITING METALLURGY STACK FOR ENHANCED RE...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Selective ball-limiting metallurgy etching processes for fabricatio...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

SELECTIVE BALL-LIMITING METALLURGY ETCHING PROCESSES FOR FABRICATIO...

Under bump metallurgy for Lead-Tin bump over copper pad

Electrochemical/ mechanical polishing

Interconnect structures and a method of electroless introduction of...

Copper-containing C4 ball-limiting metallurgy stack for enhanced re...

Thermo-mechanically robust C4 ball-limiting metallurgy to prevent f...

Dual-stack, ball-limiting metallurgy and method of making same

Interconnect structures and a method of electroless introduction of...

Electroless method of seed layer depostion, repair, and fabrication...