Maganlal S. Patel

Follow

Person

Endicott, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus, and corresponding method, for stress testing semiconduct...
- Patent number 5,604,445
- Issue date Feb 18, 1997
- International Business Machines Corporation
- Kishor V. Desai
- G01 - MEASURING TESTING
Information Patent Grant
Method of making an electronic package with enhanced heat sinking
- Patent number 5,263,245
- Issue date Nov 23, 1993
- International Business Machines Corporation
- Maganlal S. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with enhanced heat sinking
- Patent number 5,220,487
- Issue date Jun 15, 1993
- International Business Machines Corporation
- Maganlal S. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density, separable connector and contact for use therein
- Patent number 5,137,456
- Issue date Aug 11, 1992
- International Business Machines Corporation
- Kishor V. Desai
- H01 - BASIC ELECTRIC ELEMENTS