Magdalena HOIER

Person

Regensburg, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Power semiconductor module having a direct copper bonded substrate...
- Patent number 11,322,451
- Issue date May 3, 2022
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising a transistor chip module and a dri...
- Patent number 10,242,969
- Issue date Mar 26, 2019
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module having a direct copper bonded substrate...
- Patent number 10,211,158
- Issue date Feb 19, 2019
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor module and method for producing a power semicon...
- Patent number 9,924,594
- Issue date Mar 20, 2018
- Infineon Technologies AG
- Andre Arens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method of fabricating an electronic device
- Patent number 9,756,726
- Issue date Sep 5, 2017
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising two semiconductor modules and late...
- Patent number 9,196,510
- Issue date Nov 24, 2015
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Power Semiconductor Module Having a Direct Copper Bonded Substrate...
- Publication number 20190221521
- Publication date Jul 18, 2019
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a bondpad and bondpad
- Publication number 20160141259
- Publication date May 19, 2016
- INFINEON TECHNOLOGIES AG
- Magdalena HOIER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Module Having a Direct Copper Bonded Substrate...
- Publication number 20160126192
- Publication date May 5, 2016
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Comprising a Transistor Chip Module and a Dri...
- Publication number 20150130071
- Publication date May 14, 2015
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Comprising Two Semiconductor Modules and Late...
- Publication number 20150130048
- Publication date May 14, 2015
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device and Method of Fabricating an Electronic Device
- Publication number 20150124420
- Publication date May 7, 2015
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power Semiconductor Module and Method for Producing a Power Semicon...
- Publication number 20150092376
- Publication date Apr 2, 2015
- INFINEON TECHNOLOGIES AG
- Andre Arens
- H01 - BASIC ELECTRIC ELEMENTS

Magdalena HOIER

Person

Patents Grantslast 30 patents

Power semiconductor module having a direct copper bonded substrate...

Semiconductor package comprising a transistor chip module and a dri...

Power semiconductor module having a direct copper bonded substrate...

Power semiconductor module and method for producing a power semicon...

Electronic device and method of fabricating an electronic device

Semiconductor package comprising two semiconductor modules and late...

Patents Applicationslast 30 patents

Power Semiconductor Module Having a Direct Copper Bonded Substrate...

Method of forming a bondpad and bondpad

Power Semiconductor Module Having a Direct Copper Bonded Substrate...

Semiconductor Package Comprising a Transistor Chip Module and a Dri...

Semiconductor Package Comprising Two Semiconductor Modules and Late...

Electronic Device and Method of Fabricating an Electronic Device

Power Semiconductor Module and Method for Producing a Power Semicon...