Mahadevan Krishna Iyer

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer level packages and methods of fabrication
- Patent number 7,189,594
- Issue date Mar 13, 2007
- Agency for Science, Technology and Research
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device to elongate a solder joint
- Patent number 7,178,711
- Issue date Feb 20, 2007
- Agency for Science, Technology and Research
- Ee Hua Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged integrated antenna for circular and linear polarizations
- Patent number 6,879,287
- Issue date Apr 12, 2005
- Agency for Science, Technology and Research
- Alexander Pavlovich Popov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level inter-connector formation method
- Patent number 6,787,456
- Issue date Sep 7, 2004
- Agency for Science, Technology and Research
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for fluid-based cooling of heat-generating dev...
- Patent number 6,717,812
- Issue date Apr 6, 2004
- Institute of Microelectronics
- Damaruganath Pinjala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced chip scale package for wire bond dies
- Patent number 6,710,438
- Issue date Mar 23, 2004
- Institute of Microelectronics
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device carrier
- Patent number 6,617,667
- Issue date Sep 9, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Mui Seng Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced chip scale package for flip chips
- Patent number 6,608,379
- Issue date Aug 19, 2003
- Institute of Microelectronics, et al.
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High frequency board-to-board connector
- Patent number 6,599,138
- Issue date Jul 29, 2003
- Institute of Microelectronics
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEM...
- Publication number 20100170086
- Publication date Jul 8, 2010
- Agency for Science, Technology and Research
- Qasem Ramadan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device to elongate a solder joint
- Publication number 20070114266
- Publication date May 24, 2007
- Agency For Science, Technology and Research
- Ee Hua Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Compliant probes and test methodology for fine pitch wafer level de...
- Publication number 20070040565
- Publication date Feb 22, 2007
- National University of Singapore, Agency For Science, Technology and Research
- Jayasanker Jayabalan
- G01 - MEASURING TESTING
Information Patent Application
Wafer level packages and methods of fabrication
- Publication number 20060057832
- Publication date Mar 16, 2006
- Agency for Science, Technology and Research
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device to elongate a solder joint
- Publication number 20050056684
- Publication date Mar 17, 2005
- Agency for Science, Technology and Research
- Ee Hua Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaged integrated antenna for circular and linear polarizations
- Publication number 20040233107
- Publication date Nov 25, 2004
- Alexander Pavlovich Popov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL INTER-CONNECTOR FORMATION METHOD
- Publication number 20040185593
- Publication date Sep 23, 2004
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced chip scale package for wire bond dies
- Publication number 20030155641
- Publication date Aug 21, 2003
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED CHIP SCALE PACKAGE FOR FLIP CHIPS
- Publication number 20030132529
- Publication date Jul 17, 2003
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical device carrier
- Publication number 20030052380
- Publication date Mar 20, 2003
- Mui Seng Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process of forming metal surfaces compatible with a wire bonding an...
- Publication number 20020175424
- Publication date Nov 28, 2002
- Vaidyanathan Kripesh
- H01 - BASIC ELECTRIC ELEMENTS

Mahadevan Krishna Iyer

Person

Patents Grantslast 30 patents

Wafer level packages and methods of fabrication

Method and device to elongate a solder joint

Packaged integrated antenna for circular and linear polarizations

Wafer-level inter-connector formation method

Apparatus and method for fluid-based cooling of heat-generating dev...

Enhanced chip scale package for wire bond dies

Optical device carrier

Enhanced chip scale package for flip chips

High frequency board-to-board connector

Patents Applicationslast 30 patents

DEVICE, UNIT, SYSTEM AND METHOD FOR THE MAGNETICALLY-ASSISTED ASSEM...

Method and device to elongate a solder joint

Compliant probes and test methodology for fine pitch wafer level de...

Wafer level packages and methods of fabrication

Method and device to elongate a solder joint

Packaged integrated antenna for circular and linear polarizations

WAFER-LEVEL INTER-CONNECTOR FORMATION METHOD

Enhanced chip scale package for wire bond dies

ENHANCED CHIP SCALE PACKAGE FOR FLIP CHIPS

Optical device carrier

Process of forming metal surfaces compatible with a wire bonding an...