Mahadevan Survakumar

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Gilbert, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Microelectronic package and method of manufacturing same
- Patent number 8,035,218
- Issue date Oct 11, 2011
- Intel Corporation
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with increased capacitance and method
- Patent number 6,936,498
- Issue date Aug 30, 2005
- Intel Corporation
- Mahadevan Survakumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure with increased capacitance and method
- Patent number 6,787,902
- Issue date Sep 7, 2004
- Intel Corporation
- Mahadevan Survakumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Microelectronic package and method of manufacturing same
- Publication number 20110101516
- Publication date May 5, 2011
- John S. Guzek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH INCREASED CAPACITANCE AND METHOD
- Publication number 20040188825
- Publication date Sep 30, 2004
- Intel Corporation
- Mahadevan Survakumar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR