Mahesh K. Shah

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,861,764
- Issue date Dec 8, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic component mounting using sinter attachment
- Patent number 10,806,021
- Issue date Oct 13, 2020
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 10,630,243
- Issue date Apr 21, 2020
- NXP USA, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 10,476,442
- Issue date Nov 12, 2019
- NXP USA, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic modules including thermal extension levels and meth...
- Patent number 10,440,813
- Issue date Oct 8, 2019
- NXP USA, INC.
- Lu Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged microelectronic component mounting using sinter attachment
- Patent number 10,405,417
- Issue date Sep 3, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic components having integrated heat dissipation posts...
- Patent number 10,269,678
- Issue date Apr 23, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package subsystems
- Patent number 10,211,177
- Issue date Feb 19, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 10,110,170
- Issue date Oct 23, 2018
- NXP USA, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radio frequency devices with surface-mountable capacitors for decou...
- Patent number 9,800,208
- Issue date Oct 24, 2017
- NXP USA, INC.
- Mahesh K. Shah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High power semiconductor package subsystems
- Patent number 9,673,162
- Issue date Jun 6, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with isolation wall
- Patent number 9,607,953
- Issue date Mar 28, 2017
- NXP USA, INC.
- Lu Li
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Solder wettable flanges and devices and systems incorporating solde...
- Patent number 9,538,659
- Issue date Jan 3, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices, semiconductor device packages, and packaging...
- Patent number 9,484,222
- Issue date Nov 1, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Hussain H. Ladhani
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor package having an isolation wall to reduce electromag...
- Patent number 9,450,547
- Issue date Sep 20, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Radio frequency devices with surface-mountable capacitors for decou...
- Patent number 9,300,254
- Issue date Mar 29, 2016
- Freescale Semiconductor Inc.
- Mahesh K. Shah
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device with a buffer region with tightly-packed fille...
- Patent number 7,701,074
- Issue date Apr 20, 2010
- FREESCALE SEMICONDUCTOR, INC.
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with reduced package cross-talk and loss
- Patent number 7,435,625
- Issue date Oct 14, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic packaged device with die interface layer
- Patent number 7,432,133
- Issue date Oct 7, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical die singulation technique
- Patent number 7,332,414
- Issue date Feb 19, 2008
- FREESCALE SEMICONDUCTOR, INC.
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component and method of fabrication
- Patent number 5,918,112
- Issue date Jun 29, 1999
- Motorola, Inc.
- Mahesh K. Shah
- G01 - MEASURING TESTING
Information Patent Grant
Method for making a sculptured diaphragm
- Patent number 5,888,412
- Issue date Mar 30, 1999
- Motorola, Inc.
- Kathirgamasundaram Sooriakumar
- G01 - MEASURING TESTING
Information Patent Grant
High pressure sensor structure and method
- Patent number 5,581,226
- Issue date Dec 3, 1996
- Motorola, Inc.
- Mahesh Shah
- G01 - MEASURING TESTING
Information Patent Grant
Sensing transducer using a Schottky junction and having an increase...
- Patent number 5,528,069
- Issue date Jun 18, 1996
- Motorola, Inc.
- Dragan A. Mladenovic
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20200067460
- Publication date Feb 27, 2020
- NXP USA, Inc.
- Margaret A. Szymanowski
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT
- Publication number 20190342988
- Publication date Nov 7, 2019
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...
- Publication number 20190206759
- Publication date Jul 4, 2019
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20190028063
- Publication date Jan 24, 2019
- NXP USA, Inc.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT
- Publication number 20180317312
- Publication date Nov 1, 2018
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER SEMICONDUCTOR PACKAGE SUBSYSTEMS
- Publication number 20170271292
- Publication date Sep 21, 2017
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20170005621
- Publication date Jan 5, 2017
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...
- Publication number 20160164471
- Publication date Jun 9, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Mahesh K. SHAH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...
- Publication number 20150381117
- Publication date Dec 31, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Mahesh K. SHAH
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICES, SEMICONDUCTOR DEVICE PACKAGES, AND PACKAGING...
- Publication number 20150235933
- Publication date Aug 20, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Hussain H. Ladhani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...
- Publication number 20150170986
- Publication date Jun 18, 2015
- FREESCALE SEMICONDUCTOR, INC.
- Margaret A. Szymanowski
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER WETTABLE FLANGES AND DEVICES AND SYSTEMS INCORPORATING SOLDE...
- Publication number 20150055310
- Publication date Feb 26, 2015
- LAKSHMINARAYAN VISWANATHAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
HIGH POWER SEMICONDUCTOR PACKAGE SUBSYSTEMS
- Publication number 20140070397
- Publication date Mar 13, 2014
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A BUFFER REGION WITH TIGHTLY-PACKED FILLE...
- Publication number 20090001614
- Publication date Jan 1, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plastic packaged device with die interface layer
- Publication number 20070090543
- Publication date Apr 26, 2007
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with improved encapsulation
- Publication number 20070090545
- Publication date Apr 26, 2007
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device with reduced package cross-talk and loss
- Publication number 20070090542
- Publication date Apr 26, 2007
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical die singulation technique
- Publication number 20060292827
- Publication date Dec 28, 2006
- Brian W. Condie
- H01 - BASIC ELECTRIC ELEMENTS

Mahesh K. Shah

Person

Patents Grantslast 30 patents

Microelectronic components having integrated heat dissipation posts...

Packaged microelectronic component mounting using sinter attachment

Semiconductor package having an isolation wall to reduce electromag...

Semiconductor package having an isolation wall to reduce electromag...

Microelectronic modules including thermal extension levels and meth...

Packaged microelectronic component mounting using sinter attachment

Microelectronic components having integrated heat dissipation posts...

High power semiconductor package subsystems

Semiconductor package having an isolation wall to reduce electromag...

Radio frequency devices with surface-mountable capacitors for decou...

High power semiconductor package subsystems

Semiconductor package with isolation wall

Solder wettable flanges and devices and systems incorporating solde...

Semiconductor devices, semiconductor device packages, and packaging...

Semiconductor package having an isolation wall to reduce electromag...

Radio frequency devices with surface-mountable capacitors for decou...

Semiconductor device with a buffer region with tightly-packed fille...

Semiconductor device with reduced package cross-talk and loss

Plastic packaged device with die interface layer

Chemical die singulation technique

Semiconductor component and method of fabrication

Method for making a sculptured diaphragm

High pressure sensor structure and method

Sensing transducer using a Schottky junction and having an increase...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT

MICROELECTRONIC COMPONENTS HAVING INTEGRATED HEAT DISSIPATION POSTS...

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

PACKAGED MICROELECTRONIC COMPONENT MOUNTING USING SINTER ATTACHMENT

HIGH POWER SEMICONDUCTOR PACKAGE SUBSYSTEMS

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...

RADIO FREQUENCY DEVICES WITH SURFACE-MOUNTABLE CAPACITORS FOR DECOU...

SEMICONDUCTOR DEVICES, SEMICONDUCTOR DEVICE PACKAGES, AND PACKAGING...

SEMICONDUCTOR PACKAGE HAVING AN ISOLATION WALL TO REDUCE ELECTROMAG...

SOLDER WETTABLE FLANGES AND DEVICES AND SYSTEMS INCORPORATING SOLDE...

HIGH POWER SEMICONDUCTOR PACKAGE SUBSYSTEMS

SEMICONDUCTOR DEVICE WITH A BUFFER REGION WITH TIGHTLY-PACKED FILLE...

Plastic packaged device with die interface layer

Semiconductor device with improved encapsulation

Semiconductor device with reduced package cross-talk and loss

Chemical die singulation technique