Mahesh Sambasivam

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Pennington, NJ, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods of reducing bleed-out of underfill and adhesive materials
- Patent number 7,141,452
- Issue date Nov 28, 2006
- Intel Corporation
- Mahesh Sambasivam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Methods of reducing bleed-out of underfill and adhesive materials
- Publication number 20050118748
- Publication date Jun 2, 2005
- Mahesh Sambasivam
- H01 - BASIC ELECTRIC ELEMENTS