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Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
XY stage
Patent number
7,654,207
Issue date
Feb 2, 2010
NEC Corporation
Maho Shoji
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
Wire bonding apparatus and discharge method thereof
Publication number
20020043550
Publication date
Apr 18, 2002
NEC Corporation
Maho Shoji
H01 - BASIC ELECTRIC ELEMENTS