Maho Shoji

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
XY stage
- Patent number 7,654,207
- Issue date Feb 2, 2010
- NEC Corporation
- Maho Shoji
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wire bonding apparatus and discharge method thereof
- Publication number 20020043550
- Publication date Apr 18, 2002
- NEC Corporation
- Maho Shoji
- H01 - BASIC ELECTRIC ELEMENTS