Mahyar S. Dadkhah

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Harvard, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Leadless chip carrier for reduced thermal resistance
- Patent number 6,787,895
- Issue date Sep 7, 2004
- Skyworks Solutions, Inc.
- Michael J. Jarcy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip leadframe package
- Patent number 6,750,546
- Issue date Jun 15, 2004
- Skyworks Solutions, Inc.
- Robbie U. Villanueva
- H01 - BASIC ELECTRIC ELEMENTS