Maiden Grace Maming

Person

Calamba City, PH

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 12,170,240
- Issue date Dec 17, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,159,820
- Issue date Dec 3, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 12,074,100
- Issue date Aug 27, 2024
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 11,664,239
- Issue date May 30, 2023
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with lead frame with improved lead design for discrete elec...
- Patent number 11,404,355
- Issue date Aug 2, 2022
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for improving adhesive fillets on semiconductor die corners
- Patent number 11,037,864
- Issue date Jun 15, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead package with surface mounted structure
- Patent number 10,892,212
- Issue date Jan 12, 2021
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package with lead frame with improved lead design for discrete elec...
- Patent number 10,763,194
- Issue date Sep 1, 2020
- STMicroelectronics, Inc.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS
- Publication number 20230253213
- Publication date Aug 10, 2023
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS
- Publication number 20210265245
- Publication date Aug 26, 2021
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE
- Publication number 20210151368
- Publication date May 20, 2021
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE
- Publication number 20210111109
- Publication date Apr 15, 2021
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...
- Publication number 20200365492
- Publication date Nov 19, 2020
- STMicroelectronics Pte Ltd
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS
- Publication number 20190267310
- Publication date Aug 29, 2019
- STMICROELECTRONICS, INC.
- Rennier RODRIGUEZ
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE
- Publication number 20190139875
- Publication date May 9, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...
- Publication number 20190096788
- Publication date Mar 28, 2019
- STMICROELECTRONICS, INC.
- Rennier Rodriguez
- H01 - BASIC ELECTRIC ELEMENTS

Maiden Grace Maming

Person

Patents Grantslast 30 patents

Lead frame for improving adhesive fillets on semiconductor die corners

Flat no-lead package with surface mounted structure

Flat no-lead package with surface mounted structure

Lead frame for improving adhesive fillets on semiconductor die corners

Package with lead frame with improved lead design for discrete elec...

Lead frame for improving adhesive fillets on semiconductor die corners

Flat no-lead package with surface mounted structure

Package with lead frame with improved lead design for discrete elec...

Patents Applicationslast 30 patents

LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS

LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS

FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE

FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE

PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...

LEAD FRAME FOR IMPROVING ADHESIVE FILLETS ON SEMICONDUCTOR DIE CORNERS

FLAT NO-LEAD PACKAGE WITH SURFACE MOUNTED STRUCTURE

PACKAGE WITH LEAD FRAME WITH IMPROVED LEAD DESIGN FOR DISCRETE ELEC...