Maju Tomura

Person

Kurokawa-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Etching method
- Patent number 12,198,938
- Issue date Jan 14, 2025
- Tokyo Electron Limited
- Takatoshi Orui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 12,142,484
- Issue date Nov 12, 2024
- Tokyo Electron Limited
- Takahiro Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method, substrate processing apparatus, and substrate proce...
- Patent number 12,112,954
- Issue date Oct 8, 2024
- Tokyo Electron Limited
- Maju Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma etching method and plasma etching apparatus
- Patent number 12,062,522
- Issue date Aug 13, 2024
- Tokyo Electron Limited
- Keiji Kitagaito
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma processing apparatus
- Patent number 12,051,570
- Issue date Jul 30, 2024
- Tokyo Electron Limited
- Maju Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing system
- Patent number 11,996,296
- Issue date May 28, 2024
- Tokyo Electron Limited
- Kae Kumagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,961,746
- Issue date Apr 16, 2024
- Tokyo Electron Limited
- Sho Kumakura
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method, substrate processing apparatus, and substrate proce...
- Patent number 11,810,791
- Issue date Nov 7, 2023
- Tokyo Electron Limited
- Hironari Sasagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method, component processing method, and subst...
- Patent number 11,798,793
- Issue date Oct 24, 2023
- Tokyo Electron Limited
- Satoshi Ohuchida
- B08 - CLEANING
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,728,166
- Issue date Aug 15, 2023
- Tokyo Electron Limited
- Sho Kumakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching film and plasma processing apparatus
- Patent number 11,637,003
- Issue date Apr 25, 2023
- Tokyo Electron Limited
- Tomohiko Niizeki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 11,615,964
- Issue date Mar 28, 2023
- Tokyo Electron Limited
- Takahiro Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 11,600,501
- Issue date Mar 7, 2023
- Tokyo Electron Limited
- Takahiro Yokoyama
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method
- Patent number 11,551,937
- Issue date Jan 10, 2023
- Tokyo Electron Limited
- Takahiro Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 11,495,468
- Issue date Nov 8, 2022
- Tokyo Electron Limited
- Takahiro Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 11,482,425
- Issue date Oct 25, 2022
- Tokyo Electron Limited
- Ryutaro Suda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 11,456,180
- Issue date Sep 27, 2022
- Tokyo Electron Limited
- Takahiro Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,450,537
- Issue date Sep 20, 2022
- Tokyo Electron Limited
- Sho Kumakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and plasma processing apparatus
- Patent number 11,417,535
- Issue date Aug 16, 2022
- Tokyo Electron Limited
- Takahiro Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 11,417,530
- Issue date Aug 16, 2022
- Tokyo Electron Limited
- Takahiro Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 11,380,555
- Issue date Jul 5, 2022
- Tokyo Electron Limited
- Maju Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and plasma processing apparatus
- Patent number 11,361,976
- Issue date Jun 14, 2022
- Tokyo Electron Limited
- Ryutaro Suda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etching method, substrate processing apparatus, and substrate proce...
- Patent number 11,355,350
- Issue date Jun 7, 2022
- Tokyo Electron Limited
- Shinya Ishikawa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma etching method and plasma etching apparatus
- Patent number 11,355,352
- Issue date Jun 7, 2022
- Tokyo Electron Limited
- Keiji Kitagaito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 11,342,194
- Issue date May 24, 2022
- Tokyo Electron Limited
- Ryutaro Suda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 11,270,889
- Issue date Mar 8, 2022
- Tokyo Electron Limited
- Maju Tomura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for formation of protective sidewall layer for...
- Patent number 11,171,012
- Issue date Nov 9, 2021
- Tokyo Electron Limited
- Ryutaro Suda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method and etching apparatus
- Patent number 11,139,169
- Issue date Oct 5, 2021
- Tokyo Electron Limited
- Sho Kumakura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching method
- Patent number 11,127,600
- Issue date Sep 21, 2021
- Tokyo Electron Limited
- Koki Tanaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate processing method
- Patent number 11,114,304
- Issue date Sep 7, 2021
- Tokyo Electron Limited
- Takayuki Katsunuma
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ETCHING METHOD
- Publication number 20250046615
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Takahiro YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Atomic Layer Deposition of Passivation Layer
- Publication number 20250046603
- Publication date Feb 6, 2025
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20250022706
- Publication date Jan 16, 2025
- TOKYO ELECTRON LIMITED
- Tomohiko NIIZEKI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TEMPERATURE ADJUSTING SYSTEM, TEMPERATURE ADJUSTING METHOD, SUBSTRA...
- Publication number 20240412955
- Publication date Dec 12, 2024
- TOKYO ELECTRON LIMITED
- Masahiko YOKOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240355589
- Publication date Oct 24, 2024
- TOKYO ELECTRON LIMITED
- Koki MUKAIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240321562
- Publication date Sep 26, 2024
- TOKYO ELECTRON LIMITED
- Koki MUKAIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240203698
- Publication date Jun 20, 2024
- TOKYO ELECTRON LIMITED
- Ryo MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240153744
- Publication date May 9, 2024
- TOKYO ELECTRON LIMITED
- Atsushi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING SYSTEM, PLASMA PROCESSING APPARATUS, AND ETCHING...
- Publication number 20240112918
- Publication date Apr 4, 2024
- TOKYO ELECTRON LIMITED
- Noboru SAITO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Temperature Etch
- Publication number 20240112919
- Publication date Apr 4, 2024
- TOKYO ELECTRON LIMITED
- Du Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20240063026
- Publication date Feb 22, 2024
- TOKYO ELECTRON LIMITED
- Maju TOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20240038494
- Publication date Feb 1, 2024
- TOKYO ELECTRON LIMITED
- Maju TOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING APPARATUS
- Publication number 20240030010
- Publication date Jan 25, 2024
- TOKYO ELECTRON LIMITED
- Koki MUKAIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD, COMPONENT PROCESSING METHOD, AND SUBST...
- Publication number 20240006168
- Publication date Jan 4, 2024
- TOKYO ELECTRON LIMITED
- Satoshi OHUCHIDA
- B08 - CLEANING
Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20240006152
- Publication date Jan 4, 2024
- TOKYO ELECTRON LIMITED
- Maju TOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230402289
- Publication date Dec 14, 2023
- TOKYO ELECTRON LIMITED
- Kae TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230395390
- Publication date Dec 7, 2023
- TOKYO ELECTRON LIMITED
- Maju TOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230386800
- Publication date Nov 30, 2023
- TOKYO ELECTRON LIMITED
- Tomohiko NIIZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230377850
- Publication date Nov 23, 2023
- TOKYO ELECTRON LIMITED
- Satoshi OHUCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230317466
- Publication date Oct 5, 2023
- TOKYO ELECTRON LIMITED
- Satoshi OHUCHIDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230307245
- Publication date Sep 28, 2023
- TOKYO ELECTRON LIMITED
- Koki MUKAIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230307243
- Publication date Sep 28, 2023
- TOKYO ELECTRON LIMITED
- Maju TOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD
- Publication number 20230268191
- Publication date Aug 24, 2023
- TOKYO ELECTRON LIMITED
- Maju TOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230251567
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Ryutaro SUDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230245898
- Publication date Aug 3, 2023
- TOKYO ELECTRON LIMITED
- Tomohiko NIIZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND PLASMA PROCESSING SYSTEM
- Publication number 20230230844
- Publication date Jul 20, 2023
- TOKYO ELECTRON LIMITED
- Maju TOMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230223249
- Publication date Jul 13, 2023
- TOKYO ELECTRON LIMITED
- Motoi TAKAHASHI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR ETCHING FILM AND PLASMA PROCESSING APPARATUS
- Publication number 20230215707
- Publication date Jul 6, 2023
- TOKYO ELECTRON LIMITED
- Tomohiko NIIZEKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20230215700
- Publication date Jul 6, 2023
- TOKYO ELECTRON LIMITED
- Kae KUMAGAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING METHOD AND ETCHING APPARATUS
- Publication number 20230215691
- Publication date Jul 6, 2023
- TOKYO ELECTRON LIMITED
- Ryutaro SUDA
- H01 - BASIC ELECTRIC ELEMENTS

Maju Tomura

Person

Patents Grantslast 30 patents

Etching method

Etching method

Etching method, substrate processing apparatus, and substrate proce...

Plasma etching method and plasma etching apparatus

Plasma processing apparatus

Substrate processing method and substrate processing system

Substrate processing method and substrate processing apparatus

Etching method, substrate processing apparatus, and substrate proce...

Substrate processing method, component processing method, and subst...

Substrate processing method and substrate processing apparatus

Method for etching film and plasma processing apparatus

Etching method

Etching method and plasma processing apparatus

Etching method

Etching method and etching apparatus

Etching method and etching apparatus

Etching method

Substrate processing method and substrate processing apparatus

Etching method and plasma processing apparatus

Etching method

Etching method and etching apparatus

Substrate processing method and plasma processing apparatus

Etching method, substrate processing apparatus, and substrate proce...

Plasma etching method and plasma etching apparatus

Substrate processing method and substrate processing apparatus

Etching method and etching apparatus

Method and apparatus for formation of protective sidewall layer for...

Etching method and etching apparatus

Etching method

Substrate processing method

Patents Applicationslast 30 patents

ETCHING METHOD

Atomic Layer Deposition of Passivation Layer

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

TEMPERATURE ADJUSTING SYSTEM, TEMPERATURE ADJUSTING METHOD, SUBSTRA...

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

PLASMA PROCESSING SYSTEM, PLASMA PROCESSING APPARATUS, AND ETCHING...

Low-Temperature Etch

ETCHING METHOD

ETCHING METHOD AND ETCHING APPARATUS

ETCHING METHOD AND PLASMA PROCESSING APPARATUS

SUBSTRATE PROCESSING METHOD, COMPONENT PROCESSING METHOD, AND SUBST...

ETCHING METHOD AND ETCHING APPARATUS

ETCHING METHOD AND PLASMA PROCESSING SYSTEM

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

ETCHING METHOD AND PLASMA PROCESSING SYSTEM

ETCHING METHOD AND PLASMA PROCESSING SYSTEM

PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM

ETCHING METHOD AND PLASMA PROCESSING SYSTEM

ETCHING METHOD

ETCHING METHOD AND PLASMA PROCESSING SYSTEM

PLASMA PROCESSING METHOD AND PLASMA PROCESSING SYSTEM

ETCHING METHOD AND PLASMA PROCESSING SYSTEM

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

METHOD FOR ETCHING FILM AND PLASMA PROCESSING APPARATUS

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

ETCHING METHOD AND ETCHING APPARATUS