Makiko Nakamura

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Micro electro-mechanical system and method of manufacturing the same
- Patent number 7,829,365
- Issue date Nov 9, 2010
- Oki Semiconductor Co., Ltd.
- Makiko Nakamura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method of manufacturing semiconductor device having through hole wi...
- Patent number 7,176,127
- Issue date Feb 13, 2007
- Oki Electric Industry Co., Ltd.
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a tapered interconnection with insulati...
- Patent number 7,049,703
- Issue date May 23, 2006
- Oki Electric Industry Co., Ltd.
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,900,131
- Issue date May 31, 2005
- Oki Electric Industry Co., Ltd.
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 6,893,960
- Issue date May 17, 2005
- Oki Electric Industry Co., Ltd.
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having a multi-layer...
- Patent number 6,475,901
- Issue date Nov 5, 2002
- Oki Electric Industry Co., Ltd.
- Hidetomo Nishimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 6,368,959
- Issue date Apr 9, 2002
- Oki Electric Industry Co., Ltd.
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,329,719
- Issue date Dec 11, 2001
- Oki Electric Industry Co., Ltd.
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having multi-layered metalization and method o...
- Patent number 6,306,762
- Issue date Oct 23, 2001
- Electric Industry Co., Ltd.
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring structure for semiconductor device
- Patent number 6,288,450
- Issue date Sep 11, 2001
- Oki Electric Industry Co., Ltd.
- Tadashi Narita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 6,166,442
- Issue date Dec 26, 2000
- Oki Electric Industry Co., Ltd.
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multi-layered conductive structure wh...
- Patent number 5,646,449
- Issue date Jul 8, 1997
- Oki Electric Industry Co., Ltd.
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for manufacturing semiconductor device
- Publication number 20090075415
- Publication date Mar 19, 2009
- Oki Electric Industry Co., Ltd.
- Makiko Nakamura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Micro electro-mechanical system and method of manufacturing the same
- Publication number 20080224319
- Publication date Sep 18, 2008
- Oki Electric Industry Co., Ltd.
- Makiko Nakamura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor device manufacturing method
- Publication number 20080188025
- Publication date Aug 7, 2008
- Oki Electric Industry Co., Ltd.
- Makiko Nakamura
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method of manufacturing semiconductor device having through hole wi...
- Publication number 20050161831
- Publication date Jul 28, 2005
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a tapered interconnection with insulati...
- Publication number 20040198036
- Publication date Oct 7, 2004
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20040130028
- Publication date Jul 8, 2004
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20040058524
- Publication date Mar 25, 2004
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20030036260
- Publication date Feb 20, 2003
- Makiko Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20020072221
- Publication date Jun 13, 2002
- Hidetomo Nishimura
- H01 - BASIC ELECTRIC ELEMENTS

Makiko Nakamura

Person

Patents Grantslast 30 patents

Micro electro-mechanical system and method of manufacturing the same

Method of manufacturing semiconductor device having through hole wi...

Semiconductor device having a tapered interconnection with insulati...

Method of manufacturing semiconductor device

Method for manufacturing a semiconductor device

Method for manufacturing semiconductor device having a multi-layer...

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor device having multi-layered metalization and method o...

Wiring structure for semiconductor device

Semiconductor device

Semiconductor device having a multi-layered conductive structure wh...

Patents Applicationslast 30 patents

Method for manufacturing semiconductor device

Micro electro-mechanical system and method of manufacturing the same

Semiconductor device manufacturing method

Method of manufacturing semiconductor device having through hole wi...

Semiconductor device having a tapered interconnection with insulati...

Semiconductor device and manufacturing method thereof

Method of manufacturing semiconductor device

Method for manufacturing a semiconductor device

Semiconductor device and method for manufacturing the same