Makio Okada

Person

  • Hyogo, JP

Patents Grantslast 30 patents

  • Information Patent Grant

    Land grid array semiconductor device

    • Patent number 6,590,286
    • Issue date Jul 8, 2003
    • Mitsubishi Denki Kabushiki Kaisha
    • Makio Okada
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Leadframe

    • Patent number 5,223,738
    • Issue date Jun 29, 1993
    • Mitsubishi Denki Kabushiki Kaisha
    • Makio Okada
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents