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Makio Okada
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Hyogo, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Land grid array semiconductor device
Patent number
6,590,286
Issue date
Jul 8, 2003
Mitsubishi Denki Kabushiki Kaisha
Makio Okada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
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Patent Grant
Leadframe
Patent number
5,223,738
Issue date
Jun 29, 1993
Mitsubishi Denki Kabushiki Kaisha
Makio Okada
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Land grid array semiconductor device and method of mounting land gr...
Publication number
20020153608
Publication date
Oct 24, 2002
Mitsubishi Denki Kabushiki Kaisha
Makio Okada
H01 - BASIC ELECTRIC ELEMENTS