Makoto Asai

Person

Kariya-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 9,466,711
- Issue date Oct 11, 2016
- Fuji Electric Co., Ltd.
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,099,387
- Issue date Aug 4, 2015
- Denso Corporation
- Yukio Tsuzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device having SOI substrate
- Patent number 8,815,701
- Issue date Aug 26, 2014
- Denso Corporation
- Masakiyo Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor device
- Patent number 8,691,635
- Issue date Apr 8, 2014
- Fuji Electric Co., Ltd.
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having SOI substrate and method for manufactur...
- Patent number 8,278,731
- Issue date Oct 2, 2012
- Denso Corporation
- Masakiyo Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method of semiconductor device
- Patent number 8,253,222
- Issue date Aug 28, 2012
- Fuji Electric Co., Ltd.
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having insulated gate semiconductor element, a...
- Patent number 8,097,901
- Issue date Jan 17, 2012
- Denso Corporation
- Masaki Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,999,314
- Issue date Aug 16, 2011
- Denso Corporation
- Yukio Tsuzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having insulated gate semiconductor element, a...
- Patent number 7,977,704
- Issue date Jul 12, 2011
- Denso Corporation
- Masaki Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method of semiconductor substrate and sheet, and manufactur...
- Patent number 7,838,396
- Issue date Nov 23, 2010
- Denso Corporation
- Yumi Maruyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for dicing semiconductor substrate
- Patent number 7,838,331
- Issue date Nov 23, 2010
- Denso Corporation
- Atsushi Komura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for separating a semiconductor substrate into a plurality of...
- Patent number 7,662,668
- Issue date Feb 16, 2010
- Denso Corporation
- Kazuhiko Sugiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing physical quantity sensor
- Patent number 7,465,599
- Issue date Dec 16, 2008
- Denso Corporation
- Makoto Asai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor having multiple through holes
- Patent number 7,337,670
- Issue date Mar 4, 2008
- Denso Corporation
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing semiconductor physical quantity sensor
- Patent number 7,326,586
- Issue date Feb 5, 2008
- Denso Corporation
- Makoto Asai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor
- Patent number 7,271,459
- Issue date Sep 18, 2007
- Denso Corporation
- Makoto Asai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Physical quantity sensor having multiple through holes
- Patent number 7,178,400
- Issue date Feb 20, 2007
- Denso Corporation
- Minoru Murata
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160372460
- Publication date Dec 22, 2016
- Fuji Electric Co., Ltd.
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SOI SUBSTRATE AND METHOD FOR MANUFACTUR...
- Publication number 20120302036
- Publication date Nov 29, 2012
- DENSO CORPORATION
- Masakiyo Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20120289012
- Publication date Nov 15, 2012
- DENSO CORPORATION
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110254051
- Publication date Oct 20, 2011
- DENSO CORPORATION
- Yukio Tsuzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING INSULATED GATE SEMICONDUCTOR ELEMENT, A...
- Publication number 20110220962
- Publication date Sep 15, 2011
- DENSO CORPORATION
- Masaki Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20110204485
- Publication date Aug 25, 2011
- Fuji Electric Systems Co., Ltd.
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110012195
- Publication date Jan 20, 2011
- Fuji Electric Systems Co., Ltd.
- Seiji Momota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method thereof
- Publication number 20090283798
- Publication date Nov 19, 2009
- DENSO CORPORATION
- Yukio Tsuzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having insulated gate semiconductor element, a...
- Publication number 20090189181
- Publication date Jul 30, 2009
- DENSO CORPORATION
- Masaki Koyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having soi substrate and method for manufactur...
- Publication number 20090127624
- Publication date May 21, 2009
- DENSO CORPORATION
- Masakiyo Sumitomo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing physical quantity sensor
- Publication number 20080009090
- Publication date Jan 10, 2008
- DENSO CORPORATION
- Makoto Asai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Physical quantity sensor having multiple through holes
- Publication number 20070120205
- Publication date May 31, 2007
- DENSO CORPORATION
- Minoru Murata
- G01 - MEASURING TESTING
Information Patent Application
Separating device for separating semiconductor substrate and method...
- Publication number 20070111476
- Publication date May 17, 2007
- DENSO CORPORATION
- Kazuhiko Sugiura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Bonding method of semiconductor substrate and sheet, and manufactur...
- Publication number 20070111483
- Publication date May 17, 2007
- DENSO CORPORATION
- Yumi Maruyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for processing wafer
- Publication number 20070111390
- Publication date May 17, 2007
- DENSO CORPORATION
- Atsushi Komura
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wafer having multiple semiconductor elements and meth...
- Publication number 20060220183
- Publication date Oct 5, 2006
- DENSO CORPORATION
- Makoto Asai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Physical quantity sensor and method for manufacturing the same
- Publication number 20060008935
- Publication date Jan 12, 2006
- DENSO Corporation
- Makoto Asai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for manufacturing semiconductor physical quantity sensor
- Publication number 20060008936
- Publication date Jan 12, 2006
- DENSO Corporation
- Makoto Asai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Physical quantity sensor having multiple through holes
- Publication number 20050229704
- Publication date Oct 20, 2005
- DENSO Corporation
- Minoru Murata
- G01 - MEASURING TESTING

Makoto Asai

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device

Method for manufacturing semiconductor device having SOI substrate

Fabrication method of semiconductor device

Semiconductor device having SOI substrate and method for manufactur...

Semiconductor device and fabrication method of semiconductor device

Semiconductor device having insulated gate semiconductor element, a...

Semiconductor device and manufacturing method thereof

Semiconductor device having insulated gate semiconductor element, a...

Bonding method of semiconductor substrate and sheet, and manufactur...

Method for dicing semiconductor substrate

Method for separating a semiconductor substrate into a plurality of...

Method for manufacturing physical quantity sensor

Physical quantity sensor having multiple through holes

Method for manufacturing semiconductor physical quantity sensor

Physical quantity sensor

Physical quantity sensor having multiple through holes

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING SOI SUBSTRATE AND METHOD FOR MANUFACTUR...

FABRICATION METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING INSULATED GATE SEMICONDUCTOR ELEMENT, A...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor device and manufacturing method thereof

Semiconductor device having insulated gate semiconductor element, a...

Semiconductor device having soi substrate and method for manufactur...

Method for manufacturing physical quantity sensor

Physical quantity sensor having multiple through holes

Separating device for separating semiconductor substrate and method...

Bonding method of semiconductor substrate and sheet, and manufactur...

Semiconductor device and method for processing wafer

Semiconductor wafer having multiple semiconductor elements and meth...

Physical quantity sensor and method for manufacturing the same

Method for manufacturing semiconductor physical quantity sensor

Physical quantity sensor having multiple through holes