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Copper foil for printed wiring board
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Patent number 6,544,664
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Issue date Apr 8, 2003
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Mitsui Mining & Smelting Co., Ltd.
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Naotomi Takahashi
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Copper foil for printed circuit boards
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Patent number 6,322,904
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Issue date Nov 27, 2001
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Mitsui Mining & Smelting Co., Ltd.
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Makoto Dobashi
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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Composite foil of aluminum and copper
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Patent number 6,183,880
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Issue date Feb 6, 2001
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Mitsui Mining & Smelting Co., Ltd.
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Junshi Yoshioka
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C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
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Organic rust-proof treated copper foil
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Patent number 6,071,629
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Issue date Jun 6, 2000
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Mitsui Mining and Smelting Co., Ltd.
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Toshiko Yokota
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C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
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