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Makoto Nakamura
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Kawagoe-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Non-contact data carrier and method of fabricating the same
Patent number
7,018,844
Issue date
Mar 28, 2006
Dai Nippon Printing Co., Ltd.
Hiroshi Yagi
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Non-contact data carrier and method of fabricating the same
Patent number
6,774,470
Issue date
Aug 10, 2004
Dai Nippon Printing Co., Ltd.
Hiroshi Yagi
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method of manufacturing a circuit member for a resin-sealed semicon...
Patent number
6,658,734
Issue date
Dec 9, 2003
Dai Nippon Insatsu Kabushiki Kaisha
Syuichi Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin sealed semiconductor device, circuit member for use therein a...
Patent number
6,465,734
Issue date
Oct 15, 2002
Dai Nippon Insatsu Kabushiki Kaisha
Syuichi Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin sealed semiconductor device, circuit member for use therein
Patent number
6,359,221
Issue date
Mar 19, 2002
Dai Nippon Insatsu Kabushiki Kaisha
Syuichi Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Resin-sealed semiconductor device, circuit member used therefor
Patent number
6,201,292
Issue date
Mar 13, 2001
Dai Nippon Insatsu Kabushiki Kaisha
Hiroshi Yagi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Non-contact data carrier and method of fabricating the same
Publication number
20040219714
Publication date
Nov 4, 2004
Dai Nippon Printing Co., Ltd.
Hiroshi Yagi
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Non-contact data carrier and method of fabricating the same
Publication number
20030122233
Publication date
Jul 3, 2003
Dai Nippon Printing Co., Ltd.
Hiroshi Yagi
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
Resin sealed semiconductor device, circuit member for use therein a...
Publication number
20020029894
Publication date
Mar 14, 2002
Dai Nippon Insatsu Kabushiki Kaisha
Syuichi Yamada
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Resin sealed semiconductor device, circuit member for use therein a...
Publication number
20010007285
Publication date
Jul 12, 2001
Dai Nippon Insatsu Kabushiki Kaisha
Syuichi Yamada
H01 - BASIC ELECTRIC ELEMENTS