Makoto Namioka

Person

Shiojiri-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus, mold, and method for manufacturing metal-ceramic composi...
- Patent number 8,011,416
- Issue date Sep 6, 2011
- Dowa Metaltech Co., Ltd.
- Hideyo Osanai
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Power module member manufactured by wet treatment, and wet treatmen...
- Patent number 7,387,741
- Issue date Jun 17, 2008
- Dowa Mining Co., Ltd.
- Ken Iyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing metal/ceramic bonding circuit board
- Patent number 7,340,828
- Issue date Mar 11, 2008
- Dowa Mining Co., LTD
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 7,256,353
- Issue date Aug 14, 2007
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 7,189,449
- Issue date Mar 13, 2007
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus, mold, and method for manufacturing metal-ceramic composi...
- Patent number 7,131,483
- Issue date Nov 7, 2006
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal/ceramic bonding substrate and method for producing same
- Patent number 7,122,243
- Issue date Oct 17, 2006
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum/ceramic bonding substrate and method for producing same
- Patent number 7,073,703
- Issue date Jul 11, 2006
- Dowa Mining Co., Ltd.
- Takayuki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold and method for manufacturing metal-ceramic composite member
- Patent number 6,997,233
- Issue date Feb 14, 2006
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Combined member of aluminum-ceramics
- Patent number 6,912,130
- Issue date Jun 28, 2005
- Dowa Mining Co., Ltd.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal/ceramic bonding article
- Patent number 6,613,450
- Issue date Sep 2, 2003
- Dowa Mining Co., Ltd.
- Nobuyoshi Tsukaguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Power module member manufactured by wet treatment, and wet treatmen...
- Publication number 20080230515
- Publication date Sep 25, 2008
- DOWA MINING CO.,LTD
- Ken Iyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus, mold, and method for manufacturing metal-ceramic composi...
- Publication number 20070017652
- Publication date Jan 25, 2007
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Metal/ceramic bonding substrate and method for producing same
- Publication number 20050084704
- Publication date Apr 21, 2005
- DOWA MINING CO., LTD.
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal/ceramic bonding substrate and method for producing same
- Publication number 20050079329
- Publication date Apr 14, 2005
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing metal/ceramic bonding circuit board
- Publication number 20050060887
- Publication date Mar 24, 2005
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mold and method for manufacturing metal-ceramic composite member
- Publication number 20050016707
- Publication date Jan 27, 2005
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Metal/ceramic bonding substrate and method for producing same
- Publication number 20040144561
- Publication date Jul 29, 2004
- Hideyo Osanai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus, mold, and method for manufacturing metal-ceramic composi...
- Publication number 20040123968
- Publication date Jul 1, 2004
- DOWA MINING CO., LTD.
- Hideyo Osanai
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Aluminum/ceramic bonding substrate and method for producing same
- Publication number 20040074951
- Publication date Apr 22, 2004
- Takayuki Takahashi
- B32 - LAYERED PRODUCTS
Information Patent Application
Combined member of aluminum-ceramics
- Publication number 20040062009
- Publication date Apr 1, 2004
- Hideyo Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power module member manufactured by wet treatment, and wet treatmen...
- Publication number 20030213773
- Publication date Nov 20, 2003
- DOWA MINING CO., LTD.
- Ken Iyoda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal/ceramic bonding article
- Publication number 20030068532
- Publication date Apr 10, 2003
- Nobuyoshi Tsukaguchi
- B32 - LAYERED PRODUCTS

Makoto Namioka

Person

Patents Grantslast 30 patents

Apparatus, mold, and method for manufacturing metal-ceramic composi...

Power module member manufactured by wet treatment, and wet treatmen...

Method for producing metal/ceramic bonding circuit board

Metal/ceramic bonding substrate and method for producing same

Metal/ceramic bonding substrate and method for producing same

Apparatus, mold, and method for manufacturing metal-ceramic composi...

Metal/ceramic bonding substrate and method for producing same

Aluminum/ceramic bonding substrate and method for producing same

Mold and method for manufacturing metal-ceramic composite member

Combined member of aluminum-ceramics

Metal/ceramic bonding article

Patents Applicationslast 30 patents

Power module member manufactured by wet treatment, and wet treatmen...

Apparatus, mold, and method for manufacturing metal-ceramic composi...

Metal/ceramic bonding substrate and method for producing same

Metal/ceramic bonding substrate and method for producing same

Method for producing metal/ceramic bonding circuit board

Mold and method for manufacturing metal-ceramic composite member

Metal/ceramic bonding substrate and method for producing same

Apparatus, mold, and method for manufacturing metal-ceramic composi...

Aluminum/ceramic bonding substrate and method for producing same

Combined member of aluminum-ceramics

Power module member manufactured by wet treatment, and wet treatmen...

Metal/ceramic bonding article