Makoto Shirokane

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 5,056,702
- Issue date Oct 15, 1991
- Kabushiki Kaisha Toshiba
- Masako Nakahashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Brazing paste for bonding metal and ceramic
- Patent number 5,019,187
- Issue date May 28, 1991
- Kabushiki Kaisha Toshiba
- Kiyoshi Iyogi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Brazing paste for bonding metal and ceramic
- Patent number 4,924,033
- Issue date May 8, 1990
- Kabushiki Kaisha Toshiba
- Kiyoshi Iyogi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Air-tight ceramic container
- Patent number 4,917,642
- Issue date Apr 17, 1990
- Kabushiki Kaisha Toshiba
- Masako Nakahashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method of coating a nitride ceramic member
- Patent number 4,876,119
- Issue date Oct 24, 1989
- Kabushiki Kaisha Toshiba
- Hiromitsu Takeda
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Nitride ceramic-metal complex material and method of producing the...
- Patent number 4,685,607
- Issue date Aug 11, 1987
- Kabushiki Kaisha Toshiba
- Hiromitsu Takeda
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for preparing highly heat-conductive substrate and copper wi...
- Patent number 4,611,745
- Issue date Sep 16, 1986
- Kabushiki Kaisha Toshiba
- Masako Nakahashi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Makoto Shirokane

Person

Patents Grantslast 30 patents

Method of manufacturing a semiconductor device

Brazing paste for bonding metal and ceramic

Brazing paste for bonding metal and ceramic

Air-tight ceramic container

Method of coating a nitride ceramic member

Nitride ceramic-metal complex material and method of producing the...

Method for preparing highly heat-conductive substrate and copper wi...