Makoto Tabata

Follow

Person

Burghausen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number RE44986
- Issue date Jul 1, 2014
- Siltronic AG
- Clemens Zapilko
- 451 - Abrading
Information Patent Grant
Method for polishing a semiconductor wafer
- Patent number 8,157,617
- Issue date Apr 17, 2012
- Siltronic AG
- Clemens Zapilko
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method For Polishing A Semiconductor Wafer
- Publication number 20100056027
- Publication date Mar 4, 2010
- Siltronic AG
- Clemens Zapilko
- B24 - GRINDING POLISHING
Information Patent Application
Method For Producing A Semiconductor Wafer With A Polished Edge
- Publication number 20090130960
- Publication date May 21, 2009
- Siltronic AG
- Klaus Roettger
- B24 - GRINDING POLISHING