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Makoto Totani
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Kariya-city, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Circuit board and circuit board connection structure
Patent number
7,417,195
Issue date
Aug 26, 2008
Denso Corporation
Makoto Totani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Compact pressure sensor with high corrosion resistance and high acc...
Patent number
7,242,065
Issue date
Jul 10, 2007
Denso Corporation
Ichiharu Kondo
G01 - MEASURING TESTING
Information
Patent Grant
Equipment for bonding printed circuit boards
Patent number
7,240,426
Issue date
Jul 10, 2007
Denso Corporation
Makoto Totani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Pressure sensor
Patent number
7,176,541
Issue date
Feb 13, 2007
Denso Corporation
Hiroaki Tanaka
G01 - MEASURING TESTING
Information
Patent Grant
Compact pressure sensor with high corrosion resistance and high acc...
Patent number
7,168,326
Issue date
Jan 30, 2007
Denso Corporation
Inao Toyoda
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Method for connecting printed circuit boards and connected printed...
Patent number
7,080,445
Issue date
Jul 25, 2006
Denso Corporation
Toshihiro Miyake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Connecting structure of printed circuit boards
Patent number
6,966,482
Issue date
Nov 22, 2005
Denso Corporation
Makoto Totani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnection structure for interconnecting printed circuit boards
Patent number
6,784,375
Issue date
Aug 31, 2004
Denso Corporation
Toshihiro Miyake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Connecting method and connecting structure of printed circuit boards
Patent number
6,527,162
Issue date
Mar 4, 2003
Denso Corporation
Makoto Totani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing three-dimensional printed wiring board
Patent number
6,499,217
Issue date
Dec 31, 2002
Mitsubishi Plastics Inc.
Shingetsu Yamada
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for interconnecting printed circuit boards and interconnecti...
Patent number
6,449,836
Issue date
Sep 17, 2002
Denso Corporation
Toshihiro Miyake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
Pressure sensor
Publication number
20050269654
Publication date
Dec 8, 2005
DENSO Corporation
Hiroaki Tanaka
G01 - MEASURING TESTING
Information
Patent Application
Compact pressure sensor with high corrosion resistance and high acc...
Publication number
20050210993
Publication date
Sep 29, 2005
Inao Toyoda
B60 - VEHICLES IN GENERAL
Information
Patent Application
Compact pressure sensor with high corrosion resistance and high acc...
Publication number
20050205950
Publication date
Sep 22, 2005
Ichiharu Kondo
G01 - MEASURING TESTING
Information
Patent Application
Equipment and method for bonding printed circuit boards
Publication number
20040211057
Publication date
Oct 28, 2004
DENSO Corporation
Makoto Totani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Circuit board and circuit board connection structure
Publication number
20040156583
Publication date
Aug 12, 2004
DENSO Corporation
Makoto Totani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Connecting structure of printed circuit boards
Publication number
20030098339
Publication date
May 29, 2003
Makoto Totani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for connecting printed circuit boards and connected printed...
Publication number
20030079341
Publication date
May 1, 2003
Toshihiro Miyake
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for interconnecting printed circuit boards and interconnecti...
Publication number
20020189862
Publication date
Dec 19, 2002
Toshihiro Miyake
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Connecting method and connecting structure of printed circuit boards
Publication number
20020014518
Publication date
Feb 7, 2002
Makoto Totani
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR